Packaging Module Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 133,800 - 188,890 annuallyFunction: Product ManagementEducation: phdSkills: ["Cross-functional collaboration","Process improvement","Documentation","Problem-solving","Innovation"]

Lead the design, optimization, and qualification of advanced semiconductor packaging processes and equipment for Intel’s Advanced Packaging Technology Manufacturing organization. Drive improvements in yield, reliability, quality, and cost using SPC and DOE, and evaluate packaging technologies through experimental design and prototypes. Partner across teams to address technical risk, define material/equipment specifications with suppliers, and document results to standardize qualification and manufacturing methods.

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Intel
Intel
5 hours ago

Packaging Module Development Engineer

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Last checked: 5 hours agoStatus: Live

Job Summary

Lead the design, optimization, and qualification of advanced semiconductor packaging processes and equipment for Intel’s Advanced Packaging Technology Manufacturing organization. Drive improvements in yield, reliability, quality, and cost using SPC and DOE, and evaluate packaging technologies through experimental design and prototypes. Partner across teams to address technical risk, define material/equipment specifications with suppliers, and document results to standardize qualification and manufacturing methods.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Graduate level

Key Responsibilities

  • •Develop, optimize, and qualify packaging assembly processes and equipment to meet quality, reliability, yield, and cost targets.
  • •Use SPC and DOE principles to improve process efficiency and manufacturability.
  • •Lead experimental design and prototype development to evaluate packaging technologies under simulated field-use conditions.
  • •Collaborate with cross-functional teams to address risk areas and provide technical consultation on packaging challenges.
  • •Establish material and equipment specifications with suppliers, document findings, and drive standardization across qualification and manufacturing methods.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •PhD in Engineering, Physics, Chemistry, or a related STEM field.
  • •Proficiency in statistical methods, including Statistical Process Control (SPC) and Design of Experiments (DOE).
  • •Hands-on experience with process development and characterization in packaging or manufacturing environments.
  • •Familiarity with semiconductor fabrication processes, packaging flows, and assembly methodologies.
  • •Knowledge of quality systems and documentation standards for manufacturing and packaging processes.
Experience:Semiconductors
Education:PhD / Doctorate
Skills:Cross-functional collaborationProcess improvementDocumentationProblem-solvingInnovation
Tech Stack:Statistical Process Control (SPC)Design of Experiments (DOE)

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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