Staff Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: mastersSkills: ["Problem-solving","Root cause analysis","Data analysis","Collaboration","Communication"]

Lead and develop a team within HBM Package Product Engineering to improve assembly and HBM cube yields, reduce inline fallout, and strengthen cumulative yield and quality. Own root-cause and resolution efforts for qualification and RMA packaging issues using electric and physical failure analysis. Drive process conversions with cross-functional partners and use AI/ML to enhance key KPIs including quality, cost, cycle time, and scale.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

Staff Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering

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Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live

Job Summary

Lead and develop a team within HBM Package Product Engineering to improve assembly and HBM cube yields, reduce inline fallout, and strengthen cumulative yield and quality. Own root-cause and resolution efforts for qualification and RMA packaging issues using electric and physical failure analysis. Drive process conversions with cross-functional partners and use AI/ML to enhance key KPIs including quality, cost, cycle time, and scale.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Drive assembly-related coverage improvements to increase Time 0 and Field DPM while reducing/preventing assembly inline fallout.
  • •Improve HBM cube yield through test optimization and coverage, collaborating with technology development and packaging organizations.
  • •Lead cross-functional initiatives to enhance cumulative yield and overall quality improvement.
  • •Debug, identify root causes, and resolve qualification and RMA packaging issues using electric failure analysis (EFA) and physical failure analysis (PFA).
  • •Develop backend process conversions and mentor team members to improve yield, DPM, reliability, and performance; advocate and validate AI/ML models for KPI improvement.

Key Requirements

  • •Bachelor’s/Master’s degree in Electrical/Electronic/Mechanical Engineering.
  • •Strong problem-solving skills with root-cause understanding using in-depth circuit analysis.
  • •Good knowledge of statistics and data analysis tools and scripting.
  • •Demonstrated collaborative experience across teams to solve complex business and engineering problems.
  • •Passion for people leadership, with communication and presentation skills.
Education:Master's in Electrical/Electronic/Mechanical Engineering
Skills:Problem-solvingRoot cause analysisData analysisCollaborationCommunication
Tech Stack:AI/ML

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn