Director, Heterogenous Integration/Advance Packaging

Lead development of new modules in advanced semiconductor packaging as part of a global cross-functional team. Drive materials and process innovation across W2W/D2W bonding, micro bumps, TSV, thermal management, optics, and multi-wafer stacking, applying deep understanding of device physics and integration. Solve complex problems to enable new inflections in logic, DRAM, and NAND, define roadmap and differentiated modules, and manage customer engagements and project delivery.