3 months ago

Packaging Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Lead development of packaging modules for Intel's advanced packaging platforms, driving First Level Interconnect (FLI) to support future packaging platforms. Collaborate with cross-functional teams to optimize assembly processes for quality, reliability, cost, yield, and manufacturability. Drive innovation in equipment, materials, and fabrication processes; lead equipment development from pathfinding to high-volume manufacturing; manage projects to align with schedules; provide sustaining support in a fast-paced, onsite environment.

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Contribute to the advancement of technology by developing First Level Interconnect (FLI) to supportIntel's future packaging platforms.
•Collaborate with multifunctional teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
•Drive innovation in next-generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities.
•Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high-volume manufacturing.
•Manage projects to ensure alignment with product development schedules and execution milestones.

Pay and Benefits

Salary: USD 115,110 - 219,550 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
•Experience listed above should be a combination of programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
•Experience in technology development with familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) is preferred.
•Delivery of results for complex, time-critical technical projects; semiconductor fabrication processes and technologies.
•Prior related work experience within a semiconductor foundry.

Experience:3+ yearsSemiconductorPackagingHardwareManufacturing

Education:Master's

Skills:CommunicationLeadershipProblem-solvingTeam collaboration

Tech Stack:PythonMATLABAIMachine learningSPCDOE

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

3 months ago

Packaging Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Contribute to the advancement of technology by developing First Level Interconnect (FLI) to supportIntel's future packaging platforms.
•Collaborate with multifunctional teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
•Drive innovation in next-generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities.
•Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high-volume manufacturing.
•Manage projects to ensure alignment with product development schedules and execution milestones.

Pay and Benefits

Salary: USD 115,110 - 219,550 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
•Experience listed above should be a combination of programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
•Experience in technology development with familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) is preferred.
•Delivery of results for complex, time-critical technical projects; semiconductor fabrication processes and technologies.
•Prior related work experience within a semiconductor foundry.

Experience:3+ yearsSemiconductorPackagingHardwareManufacturing

Education:Master's

Skills:CommunicationLeadershipProblem-solvingTeam collaboration

Tech Stack:PythonMATLABAIMachine learningSPCDOE

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor