Quantum Packaging Thermal Architect

Intel
United States
Workplace: OnsiteFull timeUSD 141,910 - 200,340 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Communication","Analytical thinking","Problem-solving","Collaboration","Adaptability"]

Own thermal modeling and simulation of quantum packaging hardware, analyzing heat flow from silicon test chips through packaging components. Lead integration of packaging hardware and enable co-design across stakeholders, partnering with mechanical designers to define heat spreaders. Present and document design milestones, and stay current on packaging technologies by reviewing research and attending conferences to advance scalable silicon-based quantum systems.

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Intel
Intel
1 day ago

Quantum Packaging Thermal Architect

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Own thermal modeling and simulation of quantum packaging hardware, analyzing heat flow from silicon test chips through packaging components. Lead integration of packaging hardware and enable co-design across stakeholders, partnering with mechanical designers to define heat spreaders. Present and document design milestones, and stay current on packaging technologies by reviewing research and attending conferences to advance scalable silicon-based quantum systems.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Perform thermal modeling and simulation of packaging hardware to understand heat flow from silicon test chips through heat spreader hardware.
  • •Manage integration of packaging hardware and support co-design across stakeholders.
  • •Partner with mechanical designers to define heat spreaders for optimal performance.
  • •Deliver and disseminate design milestones to stakeholders.
  • •Communicate designs through presentations and relevant documentation while staying current with packaging research and developments.

Pay and Benefits

Salary: USD 141,910 - 200,340 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •MS in Electrical Engineering, Physics, or related field with 5+ years of experience in thermal modeling and simulation for packaging, or a Ph.D. in a related field with academic or work experience in these areas.
  • •Experience with thermal/mechanical modeling, simulation, and optimization using tools such as Ansys Icepak and COMSOL.
  • •Understanding of packaging technologies and thermal integration.
  • •2+ years of experience with thermal/mechanical cryogenic packaging modeling and simulation (preferred).
  • •Excellent communication and presentation skills for technical and non-technical audiences.
Experience:5+ yearsQuantum computingSemiconductorsPackagingThermal modeling
Education:Master's in Electrical Engineering, Physics or related field
Skills:CommunicationAnalytical thinkingProblem-solvingCollaborationAdaptability
Tech Stack:Ansys IcepakCOMSOL

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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