Intel

2 weeks ago

Packaging Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Join Intel’s Advanced Packaging Technology Development team to develop and optimize advanced packaging processes and equipment that support the Glass Core and CPO roadmap. Define process specifications, apply DOE to characterize process windows, and improve quality, reliability, yield, cost, automation, and productivity. Develop equipment for testing silicon and package technologies and collaborate cross-functionally to accelerate technology readiness while documenting results through technical reports and data analysis.

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Develop and optimize advanced packaging processes and equipment to support Intel’s roadmap.
•Define and implement process specifications, equipment configurations, and workflows for new technologies to integrate into manufacturing.
•Apply DOE principles to characterize process windows and analyze interactions between equipment, materials, and processes.
•Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity.
•Develop and maintain equipment for testing silicon and package technologies under simulated field conditions and document results in technical reports/white papers.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Bachelor’s or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field.
•4+ years of experience in process development, equipment adjustment, and manufacturing process control.
•Experience applying design of experiments (DOE), statistical data analysis, and statistical process control methodologies.
•Hands-on experience with material testing and characterization such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.
•Preferred: troubleshooting analytical skills and advanced statistical tools/process control frameworks; or 1 year of Photolithography experience.

Experience:4+ years

Education:Bachelor's in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry (or related technical field)

Skills:Analytical skillsTroubleshootingContinuous improvement

Tech Stack:Design of experiments (DOE)Statistical data analysisStatistical process controlDSCTGAD/TMAICPMSFTIRSEMMicrosoft OfficePhotolithographyThermal stressHumidityMechanical stress

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

2 weeks ago

Packaging Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Develop and optimize advanced packaging processes and equipment to support Intel’s roadmap.
•Define and implement process specifications, equipment configurations, and workflows for new technologies to integrate into manufacturing.
•Apply DOE principles to characterize process windows and analyze interactions between equipment, materials, and processes.
•Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity.
•Develop and maintain equipment for testing silicon and package technologies under simulated field conditions and document results in technical reports/white papers.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Bachelor’s or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field.
•4+ years of experience in process development, equipment adjustment, and manufacturing process control.
•Experience applying design of experiments (DOE), statistical data analysis, and statistical process control methodologies.
•Hands-on experience with material testing and characterization such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.
•Preferred: troubleshooting analytical skills and advanced statistical tools/process control frameworks; or 1 year of Photolithography experience.

Experience:4+ years

Education:Bachelor's in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry (or related technical field)

Skills:Analytical skillsTroubleshootingContinuous improvement

Tech Stack:Design of experiments (DOE)Statistical data analysisStatistical process controlDSCTGAD/TMAICPMSFTIRSEMMicrosoft OfficePhotolithographyThermal stressHumidityMechanical stress

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor