Staff Burn-in HW & SW Engineer

AMD
Austin
Workplace: OnsiteFull timeUSD 130,400 - 195,600 annuallyFunction: Healthcare (Clinical, Medical, Wellness)Skills: ["Communication","Data presentation","Collaboration","Technical and analytical skills","Team building"]

Own end-to-end burn-in and HTOL (High Temperature Operating Life) test development for next-gen datacenter CPU and GPU reliability. Design and validate Burn-In Board (BIB) hardware, define HTOL/BI requirements, and develop stress/test programs and reliability test code using the MCC C-Breez environment. Debug hardware/DFT issues, partner with fabrication and factories, and analyze pre/post test data to optimize qualification metrics.

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FursaFursa
AMD
AMD
1 day ago

Staff Burn-in HW & SW Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live

Job Summary

Own end-to-end burn-in and HTOL (High Temperature Operating Life) test development for next-gen datacenter CPU and GPU reliability. Design and validate Burn-In Board (BIB) hardware, define HTOL/BI requirements, and develop stress/test programs and reliability test code using the MCC C-Breez environment. Debug hardware/DFT issues, partner with fabrication and factories, and analyze pre/post test data to optimize qualification metrics.
Location: Austin
Workplace: Onsite
Employment Type: Full time
Job Function: Healthcare (Clinical, Medical, Wellness)
Seniority: Sr. Manager level

Key Responsibilities

  • •Collaborate with cross-functional teams to design custom high-power burn-in boards (BIBs) for CPU and GPUs starting early in the product development cycle.
  • •Interface with PCB fabrication and socket manufacturers to guide board development, and establish HTOL/BI pattern requirements for stress programs.
  • •Develop, integrate, debug, and maintain reliability test code using the native MCC C-Breez environment or associated platform software.
  • •Lead hardware validation of first-article boards for HTOL and burn-in, debugging hardware and PNP software issues.
  • •Analyze test data from pre/post burn-in experiments to optimize test programs and create data-logging scripts for qualification metrics; support ESD and latch-up development.

Pay and Benefits

Salary: USD 130,400 - 195,600 annually

Key Requirements

  • •BS or MS in Electrical Engineering, Computer Engineering, or equivalent.
  • •Knowledge of HTOL/BI board schematics, layout, and PCB development to define requirements.
  • •Knowledge of HTOL/BI DFT pattern architecture, pattern vector timing, and translating timing into programs for HTOL/BI stress testing.
  • •Hands-on programming experience such as Python/C++/SQL and scripting for test/logging automation.
  • •Experience with product reliability engineering and test methodology, including exposure to HTOL/BI environments and debugging with instruments like an oscilloscope and logic analyzer.
Education:
Skills:CommunicationData presentationCollaborationTechnical and analytical skillsTeam building
Tech Stack:PythonC++SQLScriptingMCCC-BreezPCBDFTHTOLBurn-inBIBOscilloscopeLogic analyzerDOEESDLatch-up

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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