Substrate/Package Layout Engineer

Broadcom
San Jose
Workplace: OnsiteFull timeUSD 141,300 - 226,000 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 7+ yearsSkills: ["Collaboration","Peer review","Problem-solving","Attention to detail"]

Design and layout advanced IC substrates and high-speed packages, including routing, functionality, and multilayer RF/package stack-up specifications. Use Cadence and EDA tools (Calibre/Klayout, Allegro Package Design, Innovus, Virtuoso) to develop and apply script-based layout workflows, perform DRC/LVS checks, and collaborate with design/verification, mechanical and electrical engineers. Evaluate fabricated parts through visual inspection, electrical testing, and characterization.

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FursaFursa
Broadcom
Broadcom
3 months ago

Substrate/Package Layout Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 21 hours agoStatus: Live

Job Summary

Design and layout advanced IC substrates and high-speed packages, including routing, functionality, and multilayer RF/package stack-up specifications. Use Cadence and EDA tools (Calibre/Klayout, Allegro Package Design, Innovus, Virtuoso) to develop and apply script-based layout workflows, perform DRC/LVS checks, and collaborate with design/verification, mechanical and electrical engineers. Evaluate fabricated parts through visual inspection, electrical testing, and characterization.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Design and layout advanced substrates and IC packages, including high-speed line layout, routing, and functionality.
  • •Develop and utilize script-based layout tools.
  • •Collaborate with design and verification teams to ensure layout meets specifications and performance requirements.
  • •Perform design rule checking (DRC) and layout vs schematic (LVS) checks.
  • •Work with substrate/package vendors to define layout/panel/stack-up specifications and evaluate fab returns via inspection and electrical characterization.

Pay and Benefits

Salary: USD 141,300 - 226,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kPaid Leave

Key Requirements

  • •Bachelors degree in Material Science/Electrical/Computer/Mechanical Engineering or related, with at least 12 years experience, or a Masters with 10+ years, or a PhD with 7+ years.
  • •Deep expertise using Cadence layout tools and EDA tools.
  • •Broad understanding of multilayer high-speed RF design, package/substrate manufacturing processes and materials, and surface mount technology.
  • •Ability to simulate designs and provide improvement suggestions.
  • •Experience with advanced substrate/package layout workflows, including verification checks and vendor collaboration.
Experience:7+ years
Education:
Skills:CollaborationPeer reviewProblem-solvingAttention to detail
Tech Stack:CalibreKlayoutCadenceAllegro Package DesignInnovusVirtuosoEDADRCLVSScript-based layout tools

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn