Quality and Reliability Engineer

Intel
Penang
Workplace: HybridFull timeFunction: Quality & Regulatory (Non-Software)Experience: 5+ yearsEducation: mastersSkills: ["Communication","Meeting skills","Self-starter","Continuous learning","Quality and zero-defect mindset"]

Drive manufacturing quality and reliability for Intel’s packaging programs at the Penang site, supporting C4 bumping and interconnect quality for WPM and ATM. Lead MRB/excursion management, containment and rapid product risk assessments, and partner with cross-functional teams on root-cause analysis and 8D corrective actions. Build early detection systems, enhance material disposition processes, and use data extraction, scripting, statistics, and machine learning to assess and present reliability data.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Intel
Intel
2 days ago

Quality and Reliability Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 2 hours agoStatus: Live
Reposted: similar role first listed 5 months ago

Job Summary

Drive manufacturing quality and reliability for Intel’s packaging programs at the Penang site, supporting C4 bumping and interconnect quality for WPM and ATM. Lead MRB/excursion management, containment and rapid product risk assessments, and partner with cross-functional teams on root-cause analysis and 8D corrective actions. Build early detection systems, enhance material disposition processes, and use data extraction, scripting, statistics, and machine learning to assess and present reliability data.
Location: Penang
Workplace: Hybrid
Employment Type: Full time
Job Function: Quality & Regulatory (Non-Software)
Seniority: Mid level

Key Responsibilities

  • •Manage manufacturing excursions by chairing MRB meetings, driving containment strategies, and performing rapid product risk assessments and discrepant material dispositions.
  • •Provide technical input on solder joint reliability and thermomechanical interactions to support risk assessment and technical decisions.
  • •Collaborate cross-functionally to drive root cause analysis and systemic corrective actions using 8D processes.
  • •Develop and implement systems for early detection and containment of excursions.
  • •Own and continuously enhance material disposition processes (e.g., RFCs and eDispo screens) and support factory commitments and ramp/certification activities.

Key Requirements

  • •Master's degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field with relevant work experience in semiconductor manufacturing, C4 bumping process, and chip assembly.
  • •5+ years of relevant work experience in semiconductor manufacturing, C4 bumping process, and chip assembly with a bachelor's degree.
  • •Experience in solder joint reliability, excursion management, and failure mode analysis.
  • •Proficiency in statistics and data analytics tools for quality and reliability assessments.
  • •Experience extracting insights from structured and unstructured data (including data mining).
Experience:5+ yearsSemiconductor manufacturingC4 bumpingChip assemblyPackaging3D FoverosSolder joint reliabilityQuality systems
Education:Master's
Skills:CommunicationMeeting skillsSelf-starterContinuous learningQuality and zero-defect mindset
Tech Stack:Data extraction toolsCustom scriptingStatistical analysisMachine learningData mining

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
WebsiteLinkedInGlassdoor