Senior Custom ASIC Engineering Lead

Broadcom
United States, Colorado
Workplace: OnsiteFull timeUSD 143,800 - 230,000 annuallyFunction: Hardware, Embedded & Systems EngineeringEducation: bachelorsSkills: ["TCL","Shell","Scripting","Verilog","RTL","EDA tools","Packaging"]

Lead cross-functional teams in physical design, STA, DFT and packaging for Broadcom’s Infrastructure ASICs across AI, HPC, networking and storage; guide customer programs from inception to production; drive design quality, risk mitigation, and EDA best practices while communicating with marketing, sales, legal and compliance.

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Broadcom
Broadcom
3 months ago

Senior Custom ASIC Engineering Lead

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Source: Company careers pageValidated by: Fursa AI
Last checked: 33 days agoStatus: Live

Job Summary

Lead cross-functional teams in physical design, STA, DFT and packaging for Broadcom’s Infrastructure ASICs across AI, HPC, networking and storage; guide customer programs from inception to production; drive design quality, risk mitigation, and EDA best practices while communicating with marketing, sales, legal and compliance.
Location: United States, Colorado
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Manage external customer ASIC programs from inception to finish, including RFQs, technology and IP collaterals, design, test, packaging, fabrication, bring-up and production
  • •Advise customers on best practices in EDA, flows and design methodologies, and by organizing Q&A sessions with Broadcom technology experts
  • •See ahead, plan ahead, work ahead. Proactively assess potential risks to the design quality and project schedule, then work with cross-functional teams to prepare and execute risk mitigation actions
  • •Execute physical design flows to check that incoming customer tape-in netlists meet Broadcom’s stringent tape-out quality standards
  • •Motivate and drive yourself to stay abreast of developments in Broadcom IPs, technology and end user applications

Pay and Benefits

Salary: USD 143,800 - 230,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kEsppPaid Leave

Key Requirements

  • •Bachelors degree and 12+ years of related experience; or Masters degree and 10+ years of related experience
  • •Hands-on experience in physical design and STA, EDA tools, design flows for physical design, logic simulation, test, and packaging
  • •Multiple tape-outs in advanced technology nodes
  • •Analyze PPA tradeoffs involved amongst various library components, and architectures
  • •Programming in TCL, shell and scripting languages
Experience:SemiconductorASICAI
Education:Bachelor's
Skills:TCLShellScriptingVerilogRTLEDA toolsPackaging
Tech Stack:TCLShellScriptingVerilogRTLEDA tools

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn