Senior Packaging Technical Engineer - Hardware

NVIDIA
Taiwan
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Communication","Self-driven","Problem-solving","Ability to work independently"]

Define and drive hardware packaging design for next-generation NVIDIA GPUs/AI platforms. Own key packaging elements including chip pad ring, substrate interconnect scheme, package layout, and ball-out, while supporting chip floorplan, substrate, and electrical integrity. Collaborate closely with circuit, signal integrity, RTL, place and route, substrate layout, and system design teams to deliver robust, world-class electrical packaging.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
NVIDIA
NVIDIA
5 days ago

Senior Packaging Technical Engineer - Hardware

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 30 minutes agoStatus: Live
Reposted: similar role first listed 7 months ago

Job Summary

Define and drive hardware packaging design for next-generation NVIDIA GPUs/AI platforms. Own key packaging elements including chip pad ring, substrate interconnect scheme, package layout, and ball-out, while supporting chip floorplan, substrate, and electrical integrity. Collaborate closely with circuit, signal integrity, RTL, place and route, substrate layout, and system design teams to deliver robust, world-class electrical packaging.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Define the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
  • •Work to define the chip floorplan, pad ring, substrate, and ball out to implement a robust electrical package.
  • •Collaborate with circuit, signal integrity, RTL, place and route, substrate layout, and system design teams.
  • •Communicate effectively with various teams throughout the company.
  • •Solve complex technical packaging problems with minimal supervision.

Key Requirements

  • •BSEE or equivalent experience.
  • •Minimum 5+ years in board/system design.
  • •Experience with package design is preferred.
  • •Strong understanding of transmission line theory, power delivery, and signal integrity.
  • •Strong programming/scripting skills in Perl, Python, and Tcl; Cadence Skill and Excel familiarity are helpful.
Experience:5+ years
Education:Bachelor's
Skills:CommunicationSelf-drivenProblem-solvingAbility to work independently
Tech Stack:PerlPythonTclCadence SkillExcel

Company Brief

NVIDIA
Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1993
Glassdoor
Glassdoor: 4.3
WebsiteLinkedInGlassdoor