Engineer, APTD CEM - Advanced Packaging Integration Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Analytical thinking","Critical thinking","Communication","Collaboration","Continuous learning"]

Develop and enable advanced packaging technology across post-fab wafer finish and assembly processes, improving product quality, yields, cost, and productivity. Drive yield improvement through silicon package integration innovation by collecting and analyzing data with layout, design, and integration flow stakeholders. Perform quality improvement by correlating defense mechanisms and establishing advanced controls. Collaborate with process, probe, yield analysis, test, and engineering teams to transition work from development through high-volume manufacturing, including POR/MOR documentation.

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Micron Technology
Micron Technology
6 months ago

Engineer, APTD CEM - Advanced Packaging Integration Engineering

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Develop and enable advanced packaging technology across post-fab wafer finish and assembly processes, improving product quality, yields, cost, and productivity. Drive yield improvement through silicon package integration innovation by collecting and analyzing data with layout, design, and integration flow stakeholders. Perform quality improvement by correlating defense mechanisms and establishing advanced controls. Collaborate with process, probe, yield analysis, test, and engineering teams to transition work from development through high-volume manufacturing, including POR/MOR documentation.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
  • •Improve product quality by driving yield improvements, reducing costs, and increasing productivity.
  • •Collect and analyze data to make actionable decisions for layout/design and integration flow changes.
  • •Achieve and improve yields through silicon package integration innovation in collaboration with engineering teams.
  • •Ensure quality through process, measurement, inspection, and testing; provide POR/MOR documentation for product transfers to production.

Key Requirements

  • •Bachelor’s or advanced degree in Engineering or Science is required.
  • •Strong analytical, logical, and critical thinking skills.
  • •Effective communication skills to collaborate across all levels.
  • •Internship or semiconductor industry experience is a plus.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics is preferred.
Experience:Semiconductor industry
Education:Bachelor's
Skills:Analytical thinkingCritical thinkingCommunicationCollaborationContinuous learning
Tech Stack:PythonRSQLVisual Basic

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn