2027 Packaging Engineer

Texas Instruments
Taiwan
Workplace: OnsiteFull timeFunction: OtherEducation: bachelorsSkills: ["Analytical and problem solving","Written communication","Verbal communication","Team collaboration","Time management"]

Design and develop semiconductor packaging technologies and partner with internal and external stakeholders to qualify products for reliability and yield. Work in cross-functional teams supporting testing, design rules, and test coverage while conducting design-of-experiments and collaborating with material suppliers to select advanced packaging materials. Use electrical, mechanical, and thermal modeling to understand silicon-to-package interaction and predict high-risk designs. Participate in TI early-career training programs.

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Texas Instruments
Texas Instruments
23 hours ago

2027 Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 15 hours agoStatus: Live

Job Summary

Design and develop semiconductor packaging technologies and partner with internal and external stakeholders to qualify products for reliability and yield. Work in cross-functional teams supporting testing, design rules, and test coverage while conducting design-of-experiments and collaborating with material suppliers to select advanced packaging materials. Use electrical, mechanical, and thermal modeling to understand silicon-to-package interaction and predict high-risk designs. Participate in TI early-career training programs.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Seniority: Graduate level

Key Responsibilities

  • •Partner with businesses to design and develop internal and external semiconductor packaging solutions (e.g., Wirebond, Flip Chip, Modules, SIPs).
  • •Participate in cross-functional teams to support product qualification and production, meeting reliability/yield and test coverage needs.
  • •Direct design-of-experiments and work with material suppliers to downselect packaging materials to improve reliability and performance.
  • •Conduct electrical, mechanical, and thermal models to understand silicon-to-package interaction and establish design rules.
  • •Work in a fast-paced environment to solve problems through hands-on learning and training programs.

Key Requirements

  • •Bachelor’s degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science, or Physics; or Electrical Engineering.
  • •Cumulative 3.0/4.0 GPA or higher.
  • •Basic understanding of statistical process control (SPC).
  • •Semiconductor packaging knowledge (manufacturing processes, assembly, reliability, materials, characterization, FA) is preferred.
  • •Strong written and verbal communication skills, with analytical and problem-solving ability.
Education:Bachelor's in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science, Physics, or Electrical Engineering
Skills:Analytical and problem solvingWritten communicationVerbal communicationTeam collaborationTime management
Languages:US

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn