Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringSkills: ["Cross-functional collaboration","Stakeholder communication","Problem-solving","Risk management"]

Lead global product integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize and synthesize requirements and test/yield learnings from multiple teams, drive execution to closure, and deliver yield breakthroughs by understanding end-to-end test flow, packaging interactions, and manufacturing processes. Characterize failure modes, set packaging technology/chip-package interaction qualification strategies, and coordinate cross-functional taskforces to resolve issues through best-known-method standardization and clear stakeholder communication.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
5 months ago

Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Lead global product integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize and synthesize requirements and test/yield learnings from multiple teams, drive execution to closure, and deliver yield breakthroughs by understanding end-to-end test flow, packaging interactions, and manufacturing processes. Characterize failure modes, set packaging technology/chip-package interaction qualification strategies, and coordinate cross-functional taskforces to resolve issues through best-known-method standardization and clear stakeholder communication.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.
  • •Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure.
  • •Drive yield breakthroughs by understanding the end-to-end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements.
  • •Define and drive strategies to ensure Packaging Technology and Chip-Package Interaction are developed and qualified ahead of product qualification.
  • •Lead cross-functional and cross-site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges and communicate status, risks, and proposals.

Key Requirements

  • •Drive global product integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.
  • •Deep understanding of the end-to-end test flow, product design and operation, packaging interactions, and manufacturing processes to balance yield vs. reliability.
  • •Use deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs to characterize device failure modes.
  • •Develop and drive strategies to ensure Packaging Technology and Chip-Package Interaction are developed and qualified ahead of product qualification.
  • •Lead cross-functional, cross-site taskforces to resolve yield and quality challenges in a timely manner.
Skills:Cross-functional collaborationStakeholder communicationProblem-solvingRisk management

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn