IC Package Mechanical FEA Engineer (R&D)

Broadcom
Colorado, United States
Workplace: OnsiteFull timeUSD 108,000 - 172,800 annuallyFunction: Research & Scientific (R&D)Experience: 3+ yearsEducation: bachelorsSkills: ["Self-management","Organization","Presentation skills","Technical documentation","Collaboration"]

Design mechanical aspects of ASIC packaging for AI, networking, HPC, and 5G applications, working within a worldwide R&D team. Use advanced FEA to quantify and optimize reliability and manufacturing outcomes, validate models with measurements and lab-scale tests, and improve accuracy using empirical data. Collaborate with package designers, reliability, and manufacturing partners across multiple time zones, and communicate findings through documentation and presentations to technical and senior stakeholders.

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FursaFursa
Broadcom
Broadcom
7 months ago

IC Package Mechanical FEA Engineer (R&D)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 days agoStatus: Live

Job Summary

Design mechanical aspects of ASIC packaging for AI, networking, HPC, and 5G applications, working within a worldwide R&D team. Use advanced FEA to quantify and optimize reliability and manufacturing outcomes, validate models with measurements and lab-scale tests, and improve accuracy using empirical data. Collaborate with package designers, reliability, and manufacturing partners across multiple time zones, and communicate findings through documentation and presentations to technical and senior stakeholders.
Location: Colorado, United States
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Mid level

Key Responsibilities

  • •Own mechanical design aspects of ASIC package designs.
  • •Use advanced FEA to quantify and optimize reliability and manufacturing outcomes.
  • •Measure and experiment to validate understanding and improve model accuracy.
  • •Collaborate with package designers, reliability, and manufacturing partners to influence mechanical design trade-offs.
  • •Schedule, prioritize, and track work across 4+ projects; document design rules and present to multiple audiences.

Pay and Benefits

Salary: USD 108,000 - 172,800 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kEquityPaid HolidaysPaid Leave

Key Requirements

  • •Bachelors in Mechanical Engineering (or similar) with 8+ years of FEA modeling experience, or Masters with 6+ years, or PhD with 3+ years.
  • •Experience using FEA to evaluate complicated numerical simulation results against first principles (e.g., strength of materials).
  • •Ability to calibrate modeling and simulation results with existing empirical data.
  • •Perform mechanical testing and measurement, including devising lab-scale tests to validate analyses.
  • •Ansys Classic/Mechanical experience preferred (equivalent tools acceptable).
Experience:3+ yearsASICsFAE modelingAINetworkingHPC5GR&D
Education:Bachelor's in Mechanical Engineering
Skills:Self-managementOrganizationPresentation skillsTechnical documentationCollaboration
Tech Stack:Finite Element Analysis (FEA)FEA modelingAnsys ClassicAnsys MechanicalASICsFlip-chip BGA (FCBGA)Multi-chip module (MCM)

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn