CMP Module Process Engineer IV - (E4)

Applied Materials
Phoenix, Boise, Dallas, Santa Clara, Oregon
Workplace: OnsiteFull timeUSD 116,000 - 159,500Function: Industrial, Process & Manufacturing EngineeringExperience: 10+ yearsEducation: bachelorsSkills: ["Communication","Mentoring","Technical leadership","Problem-solving"]

Serve as a technical expert in Chemical Mechanical Planarization (CMP) with deep Wafer Fab knowledge, using data analytics to diagnose and resolve complex CMP, yield, and integration issues. Lead continuous improvement projects tied to customer high-value problems, reduce defects/variability/COO, and optimize PM/process Cpk matching and output. Drive adoption of FabVantage technologies through demos and on-site evaluations, mentor junior engineers, and present analytic reports with root-cause insights.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Applied Materials
Applied Materials
3 months ago

CMP Module Process Engineer IV - (E4)

âś“ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 15 hours agoStatus: Live

Job Summary

Serve as a technical expert in Chemical Mechanical Planarization (CMP) with deep Wafer Fab knowledge, using data analytics to diagnose and resolve complex CMP, yield, and integration issues. Lead continuous improvement projects tied to customer high-value problems, reduce defects/variability/COO, and optimize PM/process Cpk matching and output. Drive adoption of FabVantage technologies through demos and on-site evaluations, mentor junior engineers, and present analytic reports with root-cause insights.
Location: Phoenix, Boise, Dallas, Santa Clara, Oregon
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Use analytics, equipment, and process knowledge to perform root-cause diagnostics and resolve complex tool issues using FabVantage troubleshooting methodologies.
  • •Lead continuous improvement projects (CIP) by collaborating with customers on high value problems (HVP) and implementing solutions to improve customer KPIs.
  • •Increase CSA value through defect/variability/COO reduction and PM/process Cpk matching and output optimization.
  • •Demonstrate and drive adoption of FabVantage offerings at the customer site via demos, on-site evaluations, and joint development programs.
  • •Mentor and lead junior-level MPEs and contribute to the CMP network of experts/community of practice.
Travel: Extensive travel

Pay and Benefits

Salary: USD 116,000 - 159,500

Key Requirements

  • •10+ years’ experience in Chemical Mechanical Planarization (CMP) process with a strong Wafer Fab background.
  • •Experience performing data analytics to analyze, troubleshoot, and resolve complex CMP process, yield, and integration problems.
  • •BS in Engineering.
  • •Wafer Fab / equipment experience.
  • •Regarded as the technical expert in CMP unit process and Wafer Fab operations.
Experience:10+ years
Education:Bachelor's in Engineering
Skills:CommunicationMentoringTechnical leadershipProblem-solving
Tech Stack:Chemical Mechanical Planarization (CMP)Wafer FabData analyticsFabVantageFabVantage troubleshooting methodologiesFV360BOMECFSS

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
Glassdoor
Glassdoor: 3.9
WebsiteLinkedInGlassdoor