Intel

2 weeks ago

WATD Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Drive technology development and enablement for Intel’s Wafer Assembly Technology Development (WATD) group, supporting advanced semiconductor packaging manufacturing processes from design and optimization through high-volume production. Lead module/process development using materials selection, parameter optimization, equipment metrology, and system design. Conduct feasibility studies via simulations and practical engineering methods, develop technology roadmaps, and partner with cross-functional teams and external suppliers to improve efficiency, yield, and reliability.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Drive technology development and enablement for high-volume manufacturing and future technologies.
•Lead design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
•Perform feasibility studies and pathfinding activities using simulations and practical engineering methods to meet device specifications.
•Develop and implement technology roadmaps for future manufacturing needs and industry standards.
•Collaborate with equipment and material suppliers and cross-functional teams to implement enabling process technologies and ensure process integration.

Pay and Benefits

Salary: USD 155,520 - 219,550 annually

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Bachelor’s degree in a STEM field (Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or related) with 6+ years of relevant experience.
•Or Master’s degree in the same fields with 4+ years of experience, or PhD with 2+ years of experience.
•Experience with development methodologies, statistical process control, and/or data analytics.
•Experience with wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.
•Ability to conduct feasibility studies and pathfinding to meet device specifications through simulations and practical engineering methods.

Experience:6+ yearsSemiconductor packagingWafer-level assemblyHigh-volume manufacturingManufacturing process development

Education:

Skills:CollaborationTechnical leadershipProblem-solving

Tech Stack:Statistical process controlData analyticsMachine learningSimulationsEquipment metrologyTechnology roadmapsHybrid bonded interconnectsRDL-based packagingUltra-fine pitch solder connectionsWafer-level assemblyEpoxyMold materials

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

2 weeks ago

WATD Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Drive technology development and enablement for high-volume manufacturing and future technologies.
•Lead design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
•Perform feasibility studies and pathfinding activities using simulations and practical engineering methods to meet device specifications.
•Develop and implement technology roadmaps for future manufacturing needs and industry standards.
•Collaborate with equipment and material suppliers and cross-functional teams to implement enabling process technologies and ensure process integration.

Pay and Benefits

Salary: USD 155,520 - 219,550 annually

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Bachelor’s degree in a STEM field (Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or related) with 6+ years of relevant experience.
•Or Master’s degree in the same fields with 4+ years of experience, or PhD with 2+ years of experience.
•Experience with development methodologies, statistical process control, and/or data analytics.
•Experience with wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.
•Ability to conduct feasibility studies and pathfinding to meet device specifications through simulations and practical engineering methods.

Experience:6+ yearsSemiconductor packagingWafer-level assemblyHigh-volume manufacturingManufacturing process development

Education:

Skills:CollaborationTechnical leadershipProblem-solving

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor