Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceEducation: phdSkills: ["Analytical thinking","Problem-solving","Communication","Leadership","Cross-functional collaboration"]

Develop and enable advanced metrology and inspection approaches for semiconductor advanced packaging. Create and optimize metrology recipes for production, establish best-known methods, and perform in-line characterization and validation. Lead data analysis, reporting, and continuous improvement using tools like Power BI, while managing metrology tools and defining control plans with SPC/OCAP/PCAP readiness. Coordinate cross-functionally to integrate new metrology/RDA technologies and support yield breakthroughs, including AI-assisted workflow improvements.

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Micron Technology
Micron Technology
6 days ago

Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis

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Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Develop and enable advanced metrology and inspection approaches for semiconductor advanced packaging. Create and optimize metrology recipes for production, establish best-known methods, and perform in-line characterization and validation. Lead data analysis, reporting, and continuous improvement using tools like Power BI, while managing metrology tools and defining control plans with SPC/OCAP/PCAP readiness. Coordinate cross-functionally to integrate new metrology/RDA technologies and support yield breakthroughs, including AI-assisted workflow improvements.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize metrology recipes for semiconductor processes to meet accuracy and production efficiency needs.
  • •Create inspection methodologies and best-known methods, and perform in-line characterization and validation of metrology recipes.
  • •Use data analysis tools (including Power BI) to summarize metrology recipe status, report progress, and identify improvement opportunities.
  • •Own and manage metrology tools and drive defense line readiness by setting control plans, OCAP, and SPC charts.
  • •Collaborate across teams to integrate new metrology/RDA technologies and propose yield-related breakthroughs, while applying AI-enabled tools responsibly within scope.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth Insurance

Key Requirements

  • •PhD with 2+ years (or Master’s with 5+ years, or Bachelor’s with 7+ years) in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
  • •Semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control, and packaging.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • •Experience with Visual Basic for automation and tool integration.
  • •Hands-on experience with wafer/assembly tools or metrology/RDA systems, plus familiarity with E3, FDC, RMS, and SPC/DOE/defect analysis workflows.
Experience:SemiconductorAdvanced packagingMetrologyProcess engineeringDefect analysisManufacturing
Education:PhD / Doctorate
Skills:Analytical thinkingProblem-solvingCommunicationLeadershipCross-functional collaboration
Tech Stack:PythonRSQLVisual BasicPower BIE3FDCRMSSPCDOEOCAPAI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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