Principal Engineer – Process Development, Dry Etch, NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsEducation: phdSkills: ["Technical leadership through influence","Communication","Cross-functional collaboration","Continuous improvement","Problem solving"]

Provide technical leadership for dry etch process development across critical NAND modules. Own process and critical module development for current and future nodes, drive cross-functional alignment to address structural and device challenges, and present dry etch technology roadmaps. Lead scalability solutions for high aspect ratio etches and engage suppliers/vendors to close technology gaps, while mentoring peers and delivering status and risk updates.

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Micron Technology
Micron Technology
3 months ago

Principal Engineer – Process Development, Dry Etch, NAND

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Last checked: 17 hours agoStatus: Live

Job Summary

Provide technical leadership for dry etch process development across critical NAND modules. Own process and critical module development for current and future nodes, drive cross-functional alignment to address structural and device challenges, and present dry etch technology roadmaps. Lead scalability solutions for high aspect ratio etches and engage suppliers/vendors to close technology gaps, while mentoring peers and delivering status and risk updates.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead dry etch unit process and critical module development to meet advanced NAND structural and electrical specifications.
  • •Drive cross-functional execution to solve complex structural problems and align across process areas.
  • •Present and drive dry etch process and technology roadmaps for current and future technology nodes.
  • •Develop advanced scalability solutions for high aspect ratio etches, including pulsing/advanced schemes where applicable.
  • •Lead supplier head-to-heads and vendor engagements to accelerate process/hardware solutions.

Key Requirements

  • •PhD (≥5 years), Master’s (≥7 years), or Bachelor’s (≥10 years) in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related fields.
  • •Significant dry etch process development/R&D experience with evidence of leading complex projects and cross-functional delivery.
  • •Deep dry etch technology fundamentals (plasma physics/chemistry; reactor types/chemistries) and mechanistic reasoning to outcomes.
  • •Strong SPC/DOE/statistical analysis and structured RCA for troubleshooting and continuous improvement.
  • •Technical leadership through influence, with strong communication to present roadmaps and program updates.
Experience:5+ yearsDry etchNANDProcess developmentR&DSemiconductors
Education:PhD / Doctorate
Skills:Technical leadership through influenceCommunicationCross-functional collaborationContinuous improvementProblem solving
Tech Stack:Dry etchPlasma physicsPlasma chemistrySPCDOERCAPythonAIAI-assisted tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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