2027 Undergrad ASIC Package Engineering Co-op/Intern

AMD
Austin
Workplace: HybridInternshipUSD 59,072 - 88,608 annuallyFunction: Hardware, Embedded & Systems EngineeringEducation: bachelorsSkills: ["Problem-solving","Analytical thinking"]

Join the ASIC Package Engineering team to support package design and development for AMD products. You’ll be trained to complete substrate, interposer, and bump designs, and contribute to design verification implementation. Work on yield and defect metrics, evaluate and benchmark packaging materials, and help ensure designs meet performance, quality, efficiency, and cost targets. This co-op/intern role is full-time for the specified 2027 term.

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FursaFursa
AMD
AMD
1 day ago

2027 Undergrad ASIC Package Engineering Co-op/Intern

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Source: Company careers pageValidated by: Fursa AI
Last checked: 15 hours agoStatus: Live

Job Summary

Join the ASIC Package Engineering team to support package design and development for AMD products. You’ll be trained to complete substrate, interposer, and bump designs, and contribute to design verification implementation. Work on yield and defect metrics, evaluate and benchmark packaging materials, and help ensure designs meet performance, quality, efficiency, and cost targets. This co-op/intern role is full-time for the specified 2027 term.
Location: Austin
Workplace: Hybrid
Employment Type: Internship
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Intern level

Key Responsibilities

  • •Support package design and package development engineers by prioritizing and optimizing new projects.
  • •Train to complete substrate, interposer, and bump designs for AMD products, including test vehicles and probe card substrates.
  • •Contribute to design verification implementation to ensure design performance, quality, and efficiency.
  • •Analyze yield and defect metrics to help improve design performance and yield.
  • •Evaluate and benchmark packaging materials and interact with partners to achieve cost-efficient designs and materials.

Pay and Benefits

Salary: USD 59,072 - 88,608 annually

Key Requirements

  • •Currently enrolled in a US-based bachelor’s program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
  • •Knowledge of course material related to transmission lines and electric circuits.
  • •Experience with package, silicon, or PCB design software, or strong coursework in these areas.
  • •Experience with scripting languages such as Perl, Python, and/or SQL.
  • •Understanding of semiconductor theory and packaging process/technology, plus familiarity with data analytics and visualization tools like Power BI.
Experience:SemiconductorsASIC
Education:Bachelor's in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
Skills:Problem-solvingAnalytical thinking
Tech Stack:PerlPythonSQLPower BIPCB

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn