Packaging Engineering Intern

Texas Instruments
Dallas
Workplace: OnsiteInternshipFunction: Healthcare (Clinical, Medical, Wellness)Education: bachelorsSkills: ["Analytical thinking","Problem-solving","Communication","Teamwork","Time management"]

Work across teams to support the design, development, and analysis of semiconductor packaging technologies for TI’s analog and embedded processing products. Contribute to cross-functional projects that develop and validate advanced packaging approaches such as wirebond, flip chip, modules, and SIPs, while advancing materials, mechanical, thermal, and electrical characterization. Help drive improvements in miniaturization, integration, reliability, performance, and low power.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Texas Instruments
Texas Instruments
1 week ago

Packaging Engineering Intern

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 12 hours agoStatus: Live

Job Summary

Work across teams to support the design, development, and analysis of semiconductor packaging technologies for TI’s analog and embedded processing products. Contribute to cross-functional projects that develop and validate advanced packaging approaches such as wirebond, flip chip, modules, and SIPs, while advancing materials, mechanical, thermal, and electrical characterization. Help drive improvements in miniaturization, integration, reliability, performance, and low power.
Location: Dallas
Workplace: Onsite
Employment Type: Internship
Job Function: Healthcare (Clinical, Medical, Wellness)
Seniority: Intern level

Key Responsibilities

  • •Interface across work areas and organizations to support design, development, and analysis of semiconductor packaging technologies.
  • •Participate in cross-functional teams to develop internal and external packaging solutions at different readiness stages.
  • •Cultivate packaging advancements through work in material, mechanical, thermal, and electrical characterization.
  • •Contribute to improvements in miniaturization, integration, high reliability, high performance, and low power packaging.
  • •Apply engineering talent to support TI’s advanced semiconductor packaging programs.

Key Requirements

  • •Currently pursuing a Bachelors degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related field.
  • •Cumulative 3.0/4.0 GPA or higher.
  • •Preferred: semiconductor packaging knowledge (processes, assembly, reliability, materials, characterization, FA).
  • •Demonstrated analytical and problem-solving skills.
  • •Strong written and verbal communication skills; able to collaborate effectively across functions.
Education:Bachelor's
Skills:Analytical thinkingProblem-solvingCommunicationTeamworkTime management

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn