Packaging Engineer II, New College Grad- Master's

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 90,000 - 124,000 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: mastersSkills: []

Design and maintain packaging for product assemblies and parts in support of advanced semiconductor equipment. Generate packaging specifications, research packaging materials, equipment, and methods, and perform root-cause analysis for packaging failures with corrective recommendations. Drive cost-saving improvements across designs, materials, processes, and sourcing, release updates through Engineering Change Orders, and provide basic training support to Packaging Engineer I.

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Applied Materials
Applied Materials
2 days ago

Packaging Engineer II, New College Grad- Master's

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Design and maintain packaging for product assemblies and parts in support of advanced semiconductor equipment. Generate packaging specifications, research packaging materials, equipment, and methods, and perform root-cause analysis for packaging failures with corrective recommendations. Drive cost-saving improvements across designs, materials, processes, and sourcing, release updates through Engineering Change Orders, and provide basic training support to Packaging Engineer I.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Entry level

Key Responsibilities

  • •Develop, implement, and maintain packaging designs for product assemblies and parts
  • •Generate packaging piece-part and material specifications
  • •Research and implement packaging materials, equipment, and methods; perform root cause analysis on simple packaging failures and recommend corrective action
  • •Identify and pursue cost-saving initiatives through changes in package designs, materials, equipment, processes, and sourcing strategies
  • •Release specifications via the Engineering Change Order process and provide basic training/support to Packaging Engineer I as needed
Travel: Low travel

Pay and Benefits

Salary: USD 90,000 - 124,000 annually
Equity and Bonus:Equity
Perks:RelocationTravel Allowance

Key Requirements

  • •Graduate with a Master's degree in Mechanical Engineering, Packaging Engineering, or a related field
  • •Student must be in good academic standing at their university, with a preferred GPA of 3.0 or above on a 4.0 scale
  • •Ability to apply engineering principles to develop, implement, and maintain packaging designs
  • •Research and evaluate packaging materials, equipment, and methods to benefit the business
  • •Perform root cause analysis on packaging failures and recommend corrective actions
Education:Master's in Mechanical Engineering, Packaging Engineering, or a related field

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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