Module Development Engineer

Intel
United States
Workplace: OnsiteFull timeUSD 133,800 - 188,890 annuallyFunction: Product ManagementExperience: 3+ yearsEducation: mastersSkills: ["Troubleshooting","Problem-solving","Analytical thinking","Cross-functional collaboration","Prioritization"]

Develop, optimize, and integrate advanced semiconductor manufacturing processes and metrology solutions that enable next-generation products. Lead pathfinding for innovative processes, partner with equipment and material suppliers, and drive improvements in performance, yield, efficiency, and manufacturability. Apply SPC and DOE, monitor emerging technologies, and collaborate across teams to ensure process compatibility through upstream and downstream operations.

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Intel
Intel
1 day ago

Module Development Engineer

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Last checked: 3 hours agoStatus: Live

Job Summary

Develop, optimize, and integrate advanced semiconductor manufacturing processes and metrology solutions that enable next-generation products. Lead pathfinding for innovative processes, partner with equipment and material suppliers, and drive improvements in performance, yield, efficiency, and manufacturability. Apply SPC and DOE, monitor emerging technologies, and collaborate across teams to ensure process compatibility through upstream and downstream operations.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Develop, optimize, and integrate advanced manufacturing processes, including material selection, process parameter optimization, and equipment metrology.
  • •Lead pathfinding activities to develop innovative processes for next-generation products.
  • •Partner with equipment and material suppliers to evaluate and incorporate enabling technologies into Intel's manufacturing environment.
  • •Drive process and equipment improvements to enhance performance, yield, efficiency, and manufacturability.
  • •Apply SPC and DOE using data-driven methodologies, and collaborate across teams to ensure process compatibility across manufacturing operations.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related field with 3+ years of relevant industry experience; or a PhD in the same fields with 1+ years of relevant experience.
  • •Strong knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE).
  • •Experience with semiconductor processing, system controls, and material processing.
  • •Demonstrated ability to troubleshoot and resolve complex manufacturing process and equipment challenges.
  • •Experience in advanced packaging technologies, including wafer-level assembly, epoxy and mold materials, annealing processes, or related areas.
Experience:3+ yearsSemiconductor processingAdvanced packaging
Education:Master's in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering, or related field
Skills:TroubleshootingProblem-solvingAnalytical thinkingCross-functional collaborationPrioritization
Tech Stack:SPCDesign of Experiments (DOE)MetrologySemiconductor processingSystem controlsMaterial processingAdvanced packagingWafer-level assemblyEpoxy and mold materialsAnnealing processes

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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