III-V Wafer Fab Process Engineer (Lithography)

Broadcom
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 10+ yearsEducation: bachelorsSkills: ["Process optimization","Root cause analysis","Continuous improvement","Troubleshooting","Cross-functional collaboration"]

Develop, qualify, and sustain photolithography and etch processes for III-V compound semiconductor manufacturing. Establish process windows for critical lithography parameters, qualify new photoresists and materials, and optimize lift-off for metal patterning. Support R&D through high-volume production by monitoring process health with SPC, troubleshooting excursions, improving yield, and performing root-cause analysis. Maintain process documentation and develop qualification plans for lithography/etch equipment.

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FursaFursa
Broadcom
Broadcom
1 month ago

III-V Wafer Fab Process Engineer (Lithography)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 days agoStatus: Live

Job Summary

Develop, qualify, and sustain photolithography and etch processes for III-V compound semiconductor manufacturing. Establish process windows for critical lithography parameters, qualify new photoresists and materials, and optimize lift-off for metal patterning. Support R&D through high-volume production by monitoring process health with SPC, troubleshooting excursions, improving yield, and performing root-cause analysis. Maintain process documentation and develop qualification plans for lithography/etch equipment.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize photolithography processes for III-V wafer fabrication, including process windows for exposure, focus, overlay accuracy, CD control, and defectivity.
  • •Qualify new lithography materials (photoresists, developers, BARC) and develop processes for i-line, DUV (193 nm), and aligner/stepper/scanner platforms.
  • •Plan and execute lithography/etch process qualification, defining acceptance criteria and capability targets and conducting DOE for optimization.
  • •Support manufacturing by monitoring process health with SPC, investigating excursions, implementing corrective/preventive actions, and troubleshooting yield/productivity issues.
  • •Improve yield by analyzing lithography/etch yield loss and performing root cause analysis (8D, 5 Why, Fishbone, FMEA), maintaining process control documentation and recipes.

Key Requirements

  • •Bachelor’s, Master’s, or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics.
  • •10+ years of semiconductor wafer fabrication experience.
  • •Minimum 10 years of direct experience in lithography and/or plasma etch processes.
  • •Experience with III-V semiconductor manufacturing is highly preferred.
  • •Ability to develop and optimize photolithography/etch process windows and qualification plans using structured experimentation and analysis.
Experience:10+ yearsSemiconductor manufacturingIII-V semiconductorsCompound semiconductorsR&DHigh-volume manufacturing
Education:Bachelor's in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics
Skills:Process optimizationRoot cause analysisContinuous improvementTroubleshootingCross-functional collaboration
Tech Stack:PhotolithographyEtchLithographyPlasma etchSPCDOE8D5 WhysFishboneFMEAWIControl PlansPFMEAOCAPProcess RecipesECOMask layoutReticle design

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn