Broadcom

1 day ago

III-V Wafer Fab Process Engineer (Lithography)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Develop, qualify, and sustain photolithography and etch processes for III-V compound semiconductor manufacturing. Establish process windows for critical lithography parameters, qualify new photoresists and materials, and optimize lift-off for metal patterning. Support R&D through high-volume production by monitoring process health with SPC, troubleshooting excursions, improving yield, and performing root-cause analysis. Maintain process documentation and develop qualification plans for lithography/etch equipment.

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Develop and optimize photolithography processes for III-V wafer fabrication, including process windows for exposure, focus, overlay accuracy, CD control, and defectivity.
•Qualify new lithography materials (photoresists, developers, BARC) and develop processes for i-line, DUV (193 nm), and aligner/stepper/scanner platforms.
•Plan and execute lithography/etch process qualification, defining acceptance criteria and capability targets and conducting DOE for optimization.
•Support manufacturing by monitoring process health with SPC, investigating excursions, implementing corrective/preventive actions, and troubleshooting yield/productivity issues.
•Improve yield by analyzing lithography/etch yield loss and performing root cause analysis (8D, 5 Why, Fishbone, FMEA), maintaining process control documentation and recipes.

Key Requirements

•Bachelor’s, Master’s, or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics.
•10+ years of semiconductor wafer fabrication experience.
•Minimum 10 years of direct experience in lithography and/or plasma etch processes.
•Experience with III-V semiconductor manufacturing is highly preferred.
•Ability to develop and optimize photolithography/etch process windows and qualification plans using structured experimentation and analysis.

Experience:10+ yearsSemiconductor manufacturingIII-V semiconductorsCompound semiconductorsR&DHigh-volume manufacturing

Education:Bachelor's in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics

Skills:Process optimizationRoot cause analysisContinuous improvementTroubleshootingCross-functional collaboration

Tech Stack:PhotolithographyEtchLithographyPlasma etchSPCDOE8D5 WhysFishboneFMEAWIControl PlansPFMEAOCAPProcess RecipesECOMask layoutReticle design

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

1 day ago

III-V Wafer Fab Process Engineer (Lithography)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Develop and optimize photolithography processes for III-V wafer fabrication, including process windows for exposure, focus, overlay accuracy, CD control, and defectivity.
•Qualify new lithography materials (photoresists, developers, BARC) and develop processes for i-line, DUV (193 nm), and aligner/stepper/scanner platforms.
•Plan and execute lithography/etch process qualification, defining acceptance criteria and capability targets and conducting DOE for optimization.
•Support manufacturing by monitoring process health with SPC, investigating excursions, implementing corrective/preventive actions, and troubleshooting yield/productivity issues.
•Improve yield by analyzing lithography/etch yield loss and performing root cause analysis (8D, 5 Why, Fishbone, FMEA), maintaining process control documentation and recipes.

Key Requirements

•Bachelor’s, Master’s, or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics.
•10+ years of semiconductor wafer fabrication experience.
•Minimum 10 years of direct experience in lithography and/or plasma etch processes.
•Experience with III-V semiconductor manufacturing is highly preferred.
•Ability to develop and optimize photolithography/etch process windows and qualification plans using structured experimentation and analysis.

Experience:10+ yearsSemiconductor manufacturingIII-V semiconductorsCompound semiconductorsR&DHigh-volume manufacturing

Education:Bachelor's in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics

Skills:Process optimizationRoot cause analysisContinuous improvementTroubleshootingCross-functional collaboration

Tech Stack:PhotolithographyEtchLithographyPlasma etchSPCDOE8D5 WhysFishboneFMEAWIControl PlansPFMEAOCAPProcess RecipesECOMask layoutReticle design

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn