Field Applications Engineer

Micron Technology
Taipei
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringSkills: ["Problem-solving","Troubleshooting","Self-motivation","Independent work","Cross-functional communication"]

Serve as Micron’s local execution and escalation point for High Bandwidth Memory (HBM) engagements, aligning with customers on program expansion, qualifications, and technical opportunity management. Extend and grow technical relationships with key HBM customers, support qualification and debugging with Micron/customer labs, and guide issue resolution across development and systems teams. Provide memory architecture advice, product recommendations, and hands-on technical training while working closely with Sales and business units to drive key objectives.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Field Applications Engineer

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Last checked: 21 hours agoStatus: Live

Job Summary

Serve as Micron’s local execution and escalation point for High Bandwidth Memory (HBM) engagements, aligning with customers on program expansion, qualifications, and technical opportunity management. Extend and grow technical relationships with key HBM customers, support qualification and debugging with Micron/customer labs, and guide issue resolution across development and systems teams. Provide memory architecture advice, product recommendations, and hands-on technical training while working closely with Sales and business units to drive key objectives.
Location: Taipei
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering

Key Responsibilities

  • •Align and expand HBM programs with key Micron customers, manage technical opportunities during customer engagements, and support Micron’s HBM qualifications.
  • •Extend and grow technical relationships with key HBM customers as the local execution and escalation contact.
  • •Coordinate with qualification labs to complete qualification and debug issues, influencing engagement strategies on HBM opportunities.
  • •Partner with Sales and business units to develop and execute a strategic plan and track progress to objectives.
  • •Act as an advisor by providing memory architecture advice, product recommendations, and technical trainings; serve as central point of contact during critical issues until resolution.

Key Requirements

  • •Hands-on lab skills for memory (DRAM) design-in with preferred HBM experience and lab design/deployment experience.
  • •5+ years of design, product, test, support, system, or applications engineering experience in DRAM and/or compute system design.
  • •Direct experience with GDDR and/or HBM (a plus) and systems experience spanning HBM/graphics memory, interfaces, and training/error reporting.
  • •Ability to troubleshoot and solve technical problems using lab testing tools such as an oscilloscope and logic analyzer.
  • •Excellent communication skills and the ability to work independently or in a team, collaborating with engineers across disciplines and customers at executive level.
Experience:MemoryStorageDRAMHBMSemiconductorsCompute systems
Skills:Problem-solvingTroubleshootingSelf-motivationIndependent workCross-functional communication
Tech Stack:High Bandwidth Memory (HBM)HBMDRAMGDDRGraphics MemoryMemory architectureQualificationFailure analysisNPIOscilloscopeLogic analyzerMicrosoft OfficeExcelPowerPointWord

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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