Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringSkills: ["Analytical","Problem-solving","Communication","Leadership","Stakeholder management","Cross-functional collaboration","Independent work"]

Develop and enable next-generation wafer-level advanced packaging technologies for future memory and semiconductor products. Lead process development, characterization, integration, and qualification of advanced assembly solutions—including hybrid bonding, thermo-compression bonding, and flip chip—through manufacturing transfer. Partner cross-functionally across materials, equipment, reliability, design, manufacturing, and quality to solve complex process challenges, improve process control, and ensure smooth transitions from development through high-volume manufacturing, with AI-assisted process improvement in scope.

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FursaFursa
Micron Technology
Micron Technology
11 hours ago

Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 minutes agoStatus: Live

Job Summary

Develop and enable next-generation wafer-level advanced packaging technologies for future memory and semiconductor products. Lead process development, characterization, integration, and qualification of advanced assembly solutions—including hybrid bonding, thermo-compression bonding, and flip chip—through manufacturing transfer. Partner cross-functionally across materials, equipment, reliability, design, manufacturing, and quality to solve complex process challenges, improve process control, and ensure smooth transitions from development through high-volume manufacturing, with AI-assisted process improvement in scope.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Develop and improve wafer-level process conditions and technologies, including wafer thinning and backside metal interconnect; upgrade process capabilities to reduce production costs.
  • •Establish process management projects to deliver technology node requirements and scaling for the next node.
  • •Evaluate and promote new semiconductor equipment and materials; set and tune process parameters for a variety of semiconductor equipment.
  • •Drive quality improvement through defense coverage via process/measurement/inspection/testing, correlation building, and continuous data analysis for advanced controls.
  • •Lead cross-functional process integration and transitions from new product development through qualification, small volume production, and high volume manufacturing transfer, providing POR and MOR documentation.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendHealth InsuranceEquity

Key Requirements

  • •PhD with ≥3 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
  • •Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • •Experience with Visual Basic for automation and tool integration.
  • •Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Experience:SemiconductorAdvanced packagingWafer processing
Education:
Skills:AnalyticalProblem-solvingCommunicationLeadershipStakeholder managementCross-functional collaborationIndependent work
Tech Stack:PythonRSQLVisual BasicE3FDCRMSSPCDOEDashboardingAI-enabled tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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