Packaging Research and Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 115,110 - 219,550 annuallyFunction: Research & Scientific (R&D)Experience: 1-5 yearsSkills: ["Written and verbal communication","Teamwork","Analytical skills","Engineering troubleshooting","Working with ambiguity"]

Own process and material development to scale advanced substrate packaging technology in an embedded die packaging facility. Define equipment configurations and process specifications, run comprehensive DOEs to map process windows, and drive continuous improvements across capability, quality/reliability, cost/yield, automation, and productivity. Collaborate with cross-functional teams, interact with equipment and material suppliers, and support substrate technology development on the factory floor.

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Intel
Intel
2 days ago

Packaging Research and Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 2 hours agoStatus: Live
Reposted: similar role first listed 4 months ago

Job Summary

Own process and material development to scale advanced substrate packaging technology in an embedded die packaging facility. Define equipment configurations and process specifications, run comprehensive DOEs to map process windows, and drive continuous improvements across capability, quality/reliability, cost/yield, automation, and productivity. Collaborate with cross-functional teams, interact with equipment and material suppliers, and support substrate technology development on the factory floor.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Mid level

Key Responsibilities

  • •Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies.
  • •Plan and conduct comprehensive DOEs to characterize process windows and understand process/equipment/materials interactions.
  • •Drive continuous process improvements to improve process capability/stability, quality/reliability, cost/yield, automation, and productivity.
  • •Lead and participate in cross-functional and cross-organizational teams supporting substrate technology development.
  • •Spend most time on the factory floor and interact with equipment and material suppliers to support technology scaling.
Travel: Low travel

Pay and Benefits

Salary: USD 115,110 - 219,550 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related, plus 5+ years of experience; or Master’s (3+ years); or PhD (1+ year).
  • •Semiconductor manufacturing experience and/or semiconductor technology development and material development.
  • •Experience troubleshooting and analytical skills on integrated technology issues with broad process/integration engineering teams.
  • •Experience owning process tools and using SPC, PCS, RFCs, statistical design of experiments, and process development.
  • •Experience with organic/inorganic materials and characterizations (e.g., DSC, TGA, D/TMA, titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM) and statistical analysis tools like JMP/JSL; Python, relational databases, and machine learning are highly desirable.
Experience:1-5 yearsSemiconductor manufacturingSemiconductor technology developmentMaterial development
Education:
Skills:Written and verbal communicationTeamworkAnalytical skillsEngineering troubleshootingWorking with ambiguity
Tech Stack:JMPJSLPythonSPCPCSRFCsStatistical design of experimentsDSCTGAD/TMATitrationICPMSFTIRXPSTOFSIMSEDXSEMMachine learningRelational database

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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