Neurophos

5 days ago

Senior/Staff BEOL Process Integration Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 10 hours agoStatus: Live

Job Summary

Own BEOL process integration for advanced photonic chips at a Belgium foundry partner. Define and maintain process specifications and SPC control limits, drive process transfer from development to high-volume manufacturing, and identify layout/process interactions. Lead fault isolation and physical failure analysis using metrology and characterization tools, correlate excursions to performance impacts, and drive corrective actions. Own documentation, KGD strategy, and partner closely with foundry and internal teams to improve yield, reliability, and performance.

Location: Belgium

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Mid level

Key Responsibilities

•Own the BEOL process integration flow for photonic chips, covering metallization, dielectric deposition, CMP, lithography, etch, and related steps.
•Drive process development and process transfer between development and high-volume manufacturing while defining and maintaining process specifications and SPC control limits.
•Lead fault isolation and physical failure analysis from electrical test data and inline metrology to physical root cause; execute structured debug and corrective actions (8D).
•Manage integration risks by identifying process/layout interactions, reviewing and approving GDS/GDSII layout for process compatibility, and recommending design modifications (DRC/DFM).
•Define and own BEOL process specification documents and acceptance criteria, maintain engineering documentation, and implement a Known Good Die (KGD) strategy to improve yield, reliability, and performance.

Pay and Benefits

Salary: EUR 75,000 - 100,000 annually

Perks:Health Insurance401kEquityDentalVisionLife Insurance

Key Requirements

•Education in Electrical Engineering, Materials Science, Chemical Engineering, Applied Physics, or a related discipline.
•3+ years of experience in BEOL/FEOL process integration or related roles (fab device, product, or process engineering) in a semiconductor foundry or IDM environment.
•Hands-on familiarity with BEOL/FEOL unit processes including optical lithography, dry/wet etch, thin film deposition (CVD, PVD, ALD), CMP, and metallization (Cu, W, Al).
•Ability to read and interpret GDS/GDSII files and provide DFM feedback based on process-relevant design features.
•Proven experience with fault isolation and failure analysis from electrical test data to physical root cause using SEM, FIB, TEM, EDX (or equivalent), plus SPC/process specification ownership.

Experience:3+ years

Skills:AnalyticalProblem-solvingCommunicationRoot cause analysisData analysis

Languages:English

Tech Stack:BEOLFEOLSPCGDSGDSIIDFMDRCDOEFIPFA8DKGDMetallizationLithographyDry etchWet etchThin film depositionCVDPVDALD

Company Brief

Neurophos

Develops metamaterial-based photonic optical processing units (OPUs) to deliver high-performance, energy-efficient AI inference chips for datacenters, aiming to scale photonic compute to exaflop levels.

Industry: Deep Tech

Company Size: Small (11 to 50 employees)

Growth: Growth Stage Startup

Funding: Series A

Headquarters: Austin, United States

Founded: 2020

Website LinkedIn

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Neurophos

5 days ago

Senior/Staff BEOL Process Integration Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 10 hours agoStatus: Live

Job Summary

Location: Belgium

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Mid level

Key Responsibilities

•Own the BEOL process integration flow for photonic chips, covering metallization, dielectric deposition, CMP, lithography, etch, and related steps.
•Drive process development and process transfer between development and high-volume manufacturing while defining and maintaining process specifications and SPC control limits.
•Lead fault isolation and physical failure analysis from electrical test data and inline metrology to physical root cause; execute structured debug and corrective actions (8D).
•Manage integration risks by identifying process/layout interactions, reviewing and approving GDS/GDSII layout for process compatibility, and recommending design modifications (DRC/DFM).
•Define and own BEOL process specification documents and acceptance criteria, maintain engineering documentation, and implement a Known Good Die (KGD) strategy to improve yield, reliability, and performance.

Pay and Benefits

Salary: EUR 75,000 - 100,000 annually

Perks:Health Insurance401kEquityDentalVisionLife Insurance

Key Requirements

•Education in Electrical Engineering, Materials Science, Chemical Engineering, Applied Physics, or a related discipline.
•3+ years of experience in BEOL/FEOL process integration or related roles (fab device, product, or process engineering) in a semiconductor foundry or IDM environment.
•Hands-on familiarity with BEOL/FEOL unit processes including optical lithography, dry/wet etch, thin film deposition (CVD, PVD, ALD), CMP, and metallization (Cu, W, Al).
•Ability to read and interpret GDS/GDSII files and provide DFM feedback based on process-relevant design features.
•Proven experience with fault isolation and failure analysis from electrical test data to physical root cause using SEM, FIB, TEM, EDX (or equivalent), plus SPC/process specification ownership.

Experience:3+ years

Skills:AnalyticalProblem-solvingCommunicationRoot cause analysisData analysis

Languages:English

Tech Stack:BEOLFEOLSPCGDSGDSIIDFMDRCDOEFIPFA8DKGDMetallizationLithographyDry etchWet etchThin film depositionCVDPVDALD

Company Brief

Neurophos

Industry: Deep Tech

Company Size: Small (11 to 50 employees)

Growth: Growth Stage Startup

Funding: Series A

Headquarters: Austin, United States

Founded: 2020

Website LinkedIn