Advanced Packaging Technologist (Mechanical Modeling)

AMD
Austin
Workplace: OnsiteFull timeUSD 127,190 - 218,040 annuallyFunction: Field Service, Maintenance & Skilled TradesEducation: mastersSkills: ["Self-directed","Clear communication","Cross-team collaboration","Autonomy","Technical leadership"]

Define and drive next-generation, package-centric architecture using rigorous model-based decision making and System-Technology Co-Optimization (STCO). Develop and validate multi-physics (structural, thermo-mechanical, electro-thermal, electro-optical) models to guide package/board architecture, technology selection, and integration. Partner across labs, manufacturing, PCB/EMS, and vendors to scale SMT and assembly processes, correlate simulation with experiments, and influence data center and high-performance computing platform roadmaps.

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FursaFursa
AMD
AMD
23 hours ago

Advanced Packaging Technologist (Mechanical Modeling)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Define and drive next-generation, package-centric architecture using rigorous model-based decision making and System-Technology Co-Optimization (STCO). Develop and validate multi-physics (structural, thermo-mechanical, electro-thermal, electro-optical) models to guide package/board architecture, technology selection, and integration. Partner across labs, manufacturing, PCB/EMS, and vendors to scale SMT and assembly processes, correlate simulation with experiments, and influence data center and high-performance computing platform roadmaps.
Location: Austin
Workplace: Onsite
Employment Type: Full time
Job Function: Field Service, Maintenance & Skilled Trades

Key Responsibilities

  • •Drive model-based architecture and design decisions for development and qualification of advanced package technologies, including materials, stack-ups, stiffness control, and SMT/manufacturability considerations.
  • •Develop and maintain mechanical and multi-physics models and validation strategies, partnering with internal/external labs to enable STCO across silicon, package, board, and platform.
  • •Partner with manufacturing/operations to define, optimize, and scale SMT and mechanical assembly processes, including component attach, solder joint reliability, tolerances, yield, and connector strategies.
  • •Engage PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
  • •Assess technology readiness, define targets and strategic direction for mechanical and package technology development, and influence data center platform product roadmaps.

Pay and Benefits

Salary: USD 127,190 - 218,040 annually

Key Requirements

  • •Own model-based architecture and design decisions using board-, package-, and system-level mechanical and multi-physics modeling, characterization, and validation.
  • •Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage/stiffness control, and assembly constraints.
  • •Solid foundation in Mechanics, Fracture, Materials, Design & FEA, applying first-principles understanding to multi-physics package-and-system trade-offs.
  • •Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective.
  • •MS or PhD in relevant engineering or physics disciplines.
Education:Master's in relevant engineering disciplines or physics
Skills:Self-directedClear communicationCross-team collaborationAutonomyTechnical leadership
Tech Stack:Mechanical modelingMulti-physics modelingStructural modelingThermo-mechanical modelingElectro-thermal modelingElectro-optical modelingFEASTCOSMTPCBDOESurrogate modelingReduced-order modelingAutomated optimization pipelinesML-assisted anomaly detection

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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