HBM 3D Power Delivery Network (PDN) Engineer

Micron Technology
Texas, California
Workplace: OnsiteFull timeUSD 146,000 - 297,000 annuallyFunction: Transportation & Fleet OperationsExperience: 10+ yearsEducation: mastersSkills: ["Analytical thinking","Debugging","Cross-domain collaboration","Issue resolution"]

Design and optimize power delivery networks for next-generation HBM products within the Heterogeneous Integration Group. Own PDN architecture, decoupling schemes, and routing strategies for SoC and HBM-cube levels, then perform EM/IR analysis and power integrity closure across multi-mode/corner scenarios. Collaborate across physical design, packaging, and architecture to co-optimize die-package-system interactions, validate power models, and support pre- and post-silicon debug and signoff.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

HBM 3D Power Delivery Network (PDN) Engineer

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Last checked: 20 hours agoStatus: Live

Job Summary

Design and optimize power delivery networks for next-generation HBM products within the Heterogeneous Integration Group. Own PDN architecture, decoupling schemes, and routing strategies for SoC and HBM-cube levels, then perform EM/IR analysis and power integrity closure across multi-mode/corner scenarios. Collaborate across physical design, packaging, and architecture to co-optimize die-package-system interactions, validate power models, and support pre- and post-silicon debug and signoff.
Location: Texas, California
Workplace: Onsite
Employment Type: Full time
Job Function: Transportation & Fleet Operations
Seniority: Mid level

Key Responsibilities

  • •Design and develop power delivery networks for HBM designs, including power grid architecture, routing strategies, and decoupling schemes.
  • •Perform EM/IR analysis and optimization to ensure power integrity across dynamic workloads using industry-standard tools.
  • •Collaborate with physical design teams on floorplanning, placement, and routing strategies to enable efficient PDN implementation.
  • •Drive power integrity closure across multi-mode/multi-corner scenarios by identifying and mitigating droop, noise, and electromigration risks.
  • •Build and validate power models, support signoff (EM/IR and reliability verification), and debug PDN-related issues pre- and post-silicon.

Pay and Benefits

Salary: USD 146,000 - 297,000 annually
Perks:Health InsuranceDentalVisionPaid LeavePaid Time-off

Key Requirements

  • •Strong experience designing and analyzing power delivery networks for complex SoCs or high-performance ASICs.
  • •Proficiency with EM/IR analysis tools such as Cadence RedHawk and Ansys Totem (or equivalent).
  • •Ability to use Spice-based simulation and 3D modeling for PDN networks.
  • •Solid understanding of IR drop, electromigration, dynamic voltage droop, and power noise mechanisms.
  • •Knowledge of full RTL-to-GDSII flows and signoff methodologies, with strong analytical and debugging skills.
Experience:10+ years
Education:Master's in Electrical Engineering, Computer Engineering, or a related field
Skills:Analytical thinkingDebuggingCross-domain collaborationIssue resolution
Tech Stack:HBMSoCASICPower delivery networkEM/IR analysisCadence RedHawkAnsys TotemSpice3D modelingFloorplanningRoutingRTL-to-GDSIIElectromigrationDynamic voltage droopPower noiseJEDEC

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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