STAGE - Ingénieur Procédés et matériaux - Collage F/H

Thales
France
Workplace: OnsiteInternshipFunction: Communications, PR & CommunityEducation: mastersSkills: ["Autonomie","Curiosité","Rigueur","Force de proposition"]

Join the Etrelles hardware engineering team to support qualification of new microelectronic component materials used for die attach/collage under evolving regulations. You will identify compliant materials, build and run test vehicles, characterize key properties (including thermal and physical measurements), assess reliability of prior materials, and qualify new options. You’ll also monitor technology trends and collaborate with French and international suppliers.

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FursaFursa
Thales
Thales
1 day ago

STAGE - Ingénieur Procédés et matériaux - Collage F/H

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Last checked: 18 hours agoStatus: Live

Job Summary

Join the Etrelles hardware engineering team to support qualification of new microelectronic component materials used for die attach/collage under evolving regulations. You will identify compliant materials, build and run test vehicles, characterize key properties (including thermal and physical measurements), assess reliability of prior materials, and qualify new options. You’ll also monitor technology trends and collaborate with French and international suppliers.
Location: France
Workplace: Onsite
Employment Type: Internship · Permanent
Job Function: Communications, PR & Community
Seniority: Intern level

Key Responsibilities

  • •Identify new materials that comply with updated die attach/collage-related legislation for microelectronic component reflow/reporting.
  • •Develop and perform test vehicle builds/experiments to determine key material characteristics.
  • •Evaluate the reliability of materials previously tested.
  • •Qualify the identified new materials for the targeted applications in severe radar environments.
  • •Monitor technology developments and exchange with French and international suppliers.

Key Requirements

  • •In your final year of an engineering school, master, or equivalent (Bac+5).
  • •General knowledge in materials, physics, and chemistry.
  • •Knowledge of polymeric materials and their use.
  • •Knowledge related to electronic cards/printed electronics.
  • •Knowledge of bonding/assembly of microelectronic components and thermal materials (e.g., adhesives), plus characterization experience (DSC, DMA, physical measurements) is a plus.
Experience:MicroelectronicsHardwareMaterials science
Education:Master's
Skills:AutonomieCuriositéRigueurForce de proposition
Tech Stack:DSCDMA

Company Brief

Thales
Designs and delivers advanced systems and services for aerospace, defence, security, and digital identity and cybersecurity markets, serving government and commercial customers worldwide.
Industry: Defense Technology
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Paris, France
Founded: 2000
WebsiteLinkedIn