1 day ago

Senior ASIC Package Design Automation and AI Engineer

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Last checked: 7 hours agoStatus: Live

Job Summary

Build and deploy AI-driven automation workflows to improve the efficiency, quality, and scalability of semiconductor package, bridge, and interposer design. Apply AI/ML to enhance auto-routing, placement optimization, and design verification such as rule compliance. Partner with package design teams, EDA tool teams, and vendors to implement automation features, integrate design flows, and support tape-outs, while contributing documentation and reusable best practices.

Location: Markham

Workplace: Hybrid

Employment Type: Full time

Job Function: Data Science & Machine Learning

Seniority: Mid level

Key Responsibilities

•Develop, deploy, and maintain automation frameworks and AI-assisted workflows for package substrates, silicon interposers, and bridge-based integration.
•Apply AI/ML methodologies to improve design activities including auto-routing, placement optimization, signal integrity, power delivery, and design rule compliance/verification.
•Collaborate with package design teams to identify automation opportunities, reduce manual effort and cycle time, and improve robustness and quality.
•Partner with EDA tool teams and vendors to implement automation features and support next-generation advanced packaging design enablement.
•Develop automation/tools for design flow integration, data extraction/analysis, and closed-loop optimization with simulation teams, supporting milestones and tape-outs.

Key Requirements

•Experience in semiconductor packaging or SoC physical design automation.
•Working knowledge of EDA packaging tools such as Cadence APD/SiP, Siemens Xpedition, and Synopsys 3DICC (or equivalent).
•Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++.
•Experience applying AI/ML techniques to engineering or design workflows, with familiarity with frameworks such as PyTorch or TensorFlow.
•Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.

Experience:Semiconductor packagingSoC physical design automationAI/ML

Education:Bachelor's in Electrical Engineering, Computer Engineering, Computer Science or related field

Skills:Problem-solvingOwnership mindsetCommunicationCross-functional collaboration

Languages:English

Tech Stack:PythonTclSKILLC++PyTorchTensorFlowCadence APD / SiPSiemens XpeditionSynopsys 3DIC CEDAAI/MLAuto-routingPlacement optimizationSignal integrityPower deliveryDesign rule complianceVerificationDRCLVSParasitic extraction

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD