Engineer, Product Development Engineering Key Equipment Group (PDE KEG)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & Community0Skills: ["Fast learning","Initiative","Independence","Teamwork","Cross-functional collaboration","Communication","Presentation","Project management","Analytical thinking","Critical thinking","Growth mindset"]

Identify, select, and evaluate new highly automated equipment and technologies for semiconductor assembly and advanced packaging requirements. Define equipment design/capability needs, work with suppliers, and support equipment benchmarking, installation, qualification, and handover to production. Maintain equipment maturity metrics (EMI) and tool constraints (TOR), enable equipment monitoring and automation systems (PCS/IT & automation), and collaborate on continuous-improvement upgrades with production and HVM teams.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

Engineer, Product Development Engineering Key Equipment Group (PDE KEG)

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Identify, select, and evaluate new highly automated equipment and technologies for semiconductor assembly and advanced packaging requirements. Define equipment design/capability needs, work with suppliers, and support equipment benchmarking, installation, qualification, and handover to production. Maintain equipment maturity metrics (EMI) and tool constraints (TOR), enable equipment monitoring and automation systems (PCS/IT & automation), and collaborate on continuous-improvement upgrades with production and HVM teams.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and effectiveness while complying with standards and legal requirements.
  • •Support evaluation and qualification of new equipment platforms, including defining capability requirements aligned to the process and packaging roadmap.
  • •Plan capital requests, create/own purchasing specification (Doc2), establish qualification criteria/roadmaps, and prepare handover documentation to production site owners.
  • •Maintain and regularly update equipment maturity metrics (EMI) and tool of records (TOR), incorporating inputs from local/other assembly sites.
  • •Enable equipment characterization and parameter monitoring, partnering with PCS/IT & automation teams on tool control systems and automation solution readiness and deployment.
Travel: Low travel

Key Requirements

  • •PhD/Master’s/Bachelor’s degree in electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics, or equivalent.
  • •0–2 years’ experience in the related semiconductor industry or manufacturing environment.
  • •Basic knowledge of semiconductor manufacturing assembly, wafer bumping, packaging technologies, and advanced packaging techniques.
  • •Strong communication and presentation skills; English speaking is required.
  • •Ability to work with cross-functional teams and external vendors, with strong project management skills to execute to timelines.
Experience:0Semiconductor industryManufacturing environmentAdvanced packaging
Education:
Skills:Fast learningInitiativeIndependenceTeamworkCross-functional collaborationCommunicationPresentationProject managementAnalytical thinkingCritical thinkingGrowth mindset
Languages:English
Tech Stack:AI-assisted toolsFault detection & classification (FDC)E3 (enterprise equipment engineering)Advanced process control (APC)Tool alarm systemInternet of Things (IoT)Equipment constant management (ECM)Run to run (R2R)Process Control System (PCS)System datamationFactory Automated Material Handling System (AMHS)AI-enabled tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn