Sr Advanced Packaging Technology Development Engineer, Bonding process

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 2+ yearsEducation: mastersSkills: ["Independent thinking","Teamwork","Innovative mindset","Motivation","Fluent communication"]

Lead HBM process development and yield improvement for WSS processes, and drive advanced packaging technology R&D including chip stacking and 2.5D/3D. Troubleshoot complex bonding and related process engineering issues with root-cause analysis, and support on-site project execution as a technical consultant. Coordinate mechanical/material characterization globally, recommend test structures, and present findings to align materials and packaging roadmaps with suppliers.

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FursaFursa
Micron Technology
Micron Technology
5 days ago

Sr Advanced Packaging Technology Development Engineer, Bonding process

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Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live
Reposted: similar role first listed 1 day ago

Job Summary

Lead HBM process development and yield improvement for WSS processes, and drive advanced packaging technology R&D including chip stacking and 2.5D/3D. Troubleshoot complex bonding and related process engineering issues with root-cause analysis, and support on-site project execution as a technical consultant. Coordinate mechanical/material characterization globally, recommend test structures, and present findings to align materials and packaging roadmaps with suppliers.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Drive HBM process development and yield improvement in WSS process.
  • •Assist advanced package technology research and development (chip stacking, 2.5D or 3D).
  • •Support on-site project execution and make decisions as a technical consultant.
  • •Troubleshoot complex problems using root-cause analysis to resolve process engineering issues.
  • •Coordinate mechanical characterization for advanced packaging development and provide recommendations for test structure/vehicle design; review, summarize, and present data and lead supplier discussions.

Key Requirements

  • •Master’s degree (PhD is plus) in Chemistry, Physics, Materials, or related engineering science fields.
  • •At least 2 years of experience in bonding-related work.
  • •Solid understanding of WSS/bond advanced technologies, including one or more: Temporary bonding/debonding (TBDB), Hybrid Bonding, or Fusion Bonding/Direct wafer bonding.
  • •Knowledge of bonding mechanisms such as surface activation, adhesion physics, interface energy, thermo-compression, and plasma-assisted bonding.
  • •Hands-on experience with bonding-related tools (e.g., SUSS, EVG, TEL) is a plus; must communicate fluently in English and Chinese.
Experience:2+ years
Education:Master's in Chemistry, Physic, Material, engineering science related fields
Skills:Independent thinkingTeamworkInnovative mindsetMotivationFluent communication
Languages:EnglishChinese
Tech Stack:WSSTBDBHybrid BondingFusion BondingDirect wafer bondingSurface activationAdhesion physicsInterface energyThermo-compressionPlasma-assisted bondingSUSSEVGTELMechanical characterizationMaterials characterization

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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