Process Integration Engineer

Micron Technology
Boise, Idaho
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: bachelorsSkills: ["Collaboration","Problem-solving","Root-cause analysis","Process improvement","Cross-functional coordination"]

Drive process integration for DRAM technology transfer into Micron’s new Boise fabrication facility, supporting yield ramp, cost reduction, and quality improvements to production level. As a module owner, lead root-cause investigations, failure analysis, DOE-based process capability enhancements, and reliability improvements. Coordinate with technology development, quality, design, and central teams to qualify processes, tools, and materials for next-generation device introduction, including international tech-transfer travel for training.

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Micron Technology
Micron Technology
1 week ago

Process Integration Engineer

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Last checked: 12 hours agoStatus: Live

Job Summary

Drive process integration for DRAM technology transfer into Micron’s new Boise fabrication facility, supporting yield ramp, cost reduction, and quality improvements to production level. As a module owner, lead root-cause investigations, failure analysis, DOE-based process capability enhancements, and reliability improvements. Coordinate with technology development, quality, design, and central teams to qualify processes, tools, and materials for next-generation device introduction, including international tech-transfer travel for training.
Location: Boise, Idaho
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments.
  • •Drive improvements in yield, cost efficiency, and quality.
  • •Run Design of Experiments (DOE) to enhance process capability and margin and address top detractors.
  • •Lead workshops during technology transfer for next-generation devices and start up, develop, and optimize processes for quality and reliability.
  • •Coordinate and execute process, equipment, and material evaluations; validate and qualify new processes, tools, and materials for new product introduction.
Travel: Extensive travel

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Bachelor’s degree with a minimum 3 years of HVM or FAB experience.
  • •3 years of experience working with Memory (DRAM preferred).
  • •2 years of experience in semiconductor fabrication areas such as yield ramp, cost reduction, and quality improvement.
  • •Clear understanding of transistor operations, scaling limitations, and reliability.
  • •Be prepared to work a shifted schedule as required.
Experience:3+ yearsSemiconductorsSemiconductor fabricationDRAMHVM300mmYield ramp
Education:Bachelor's
Skills:CollaborationProblem-solvingRoot-cause analysisProcess improvementCross-functional coordination
Tech Stack:DRAMPIEDesign of Experiments (DOE)Failure analysisTech transferYield rampQuality improvementReliabilityModule ownership300mm environmentSWRProcess transferTrend sustainingQRBKM

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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