Intel

1 month ago

Packaging Thermal Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Seeking a Packaging Thermal Engineer to perform thermal analysis for advanced semiconductor packaging, using CFD tools and measurement validation. Design and develop Thermal Test Vehicles, correlate simulations with hardware measurements, and lead end-to-end thermo-mechanical work in a hybrid Intel environment (Taiwan, Hsinchu). Collaborate with internal teams and external suppliers to optimize thermal performance.

Location: Taiwan

Workplace: Hybrid

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

•Thermal Test Vehicle (TTV) design and development from concept to validation.
•Architect and design thermal test vehicles to mimic realistic chip/package power distributions.
•Define heater layouts and sensing strategies for correlation accuracy.
•Lead end-to-end execution from concept to fabrication to validation.
•Establish robust methodologies for correlating CFD/thermal simulations with experimental data.

Key Requirements

•Bachelor or Master in Mechanical Engineering or related field with focus on packaging thermal and mechanical aspects.
•5+ years of experience in packaging thermal simulation analysis and measurement characterization.
•Familiarity with CFD tools (Icepak, FloTherm) and thermal measurement techniques (thermocouples, IR).
•Experience with packaging thermal materials (heat sinks, thermal interface materials) and heater design optimization.
•Capability with thermal-mechanical simulation is a plus; knowledge of 2.5D/3D packaging is a plus.

Experience:5+ yearsSemiconductor packagingThermal analysisCFD

Education:Bachelor's

Skills:Heat transferElectronics coolingThermocouplesIRHeater designModel-to-hardware correlationCompact modellingReduced-order modelling

Tech Stack:IcepakFloThermCFDThermal measurementRC networksFoster models

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 month ago

Packaging Thermal Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Location: Taiwan

Workplace: Hybrid

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

•Thermal Test Vehicle (TTV) design and development from concept to validation.
•Architect and design thermal test vehicles to mimic realistic chip/package power distributions.
•Define heater layouts and sensing strategies for correlation accuracy.
•Lead end-to-end execution from concept to fabrication to validation.
•Establish robust methodologies for correlating CFD/thermal simulations with experimental data.

Key Requirements

•Bachelor or Master in Mechanical Engineering or related field with focus on packaging thermal and mechanical aspects.
•5+ years of experience in packaging thermal simulation analysis and measurement characterization.
•Familiarity with CFD tools (Icepak, FloTherm) and thermal measurement techniques (thermocouples, IR).
•Experience with packaging thermal materials (heat sinks, thermal interface materials) and heater design optimization.
•Capability with thermal-mechanical simulation is a plus; knowledge of 2.5D/3D packaging is a plus.

Experience:5+ yearsSemiconductor packagingThermal analysisCFD

Education:Bachelor's

Skills:Heat transferElectronics coolingThermocouplesIRHeater designModel-to-hardware correlationCompact modellingReduced-order modelling

Tech Stack:IcepakFloThermCFDThermal measurementRC networksFoster models

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor