Mechanical Engineer || System Integration || FEA with Ansys || APDL , 2.5D, 3D Packaging || Exp - 7 to 10 years

Cisco
Bengaluru
Workplace: OnsiteFull timeFunction: Field Service, Maintenance & Skilled TradesExperience: 7+ yearsEducation: mastersSkills: ["FEA","ANSYS","Multiphysics","Flotherm","CFD","DOE","Mechanical design"]

Join Cisco’s Systems & Optics team to shape next‑generation packaging, board, and system technologies. You will drive advanced simulation and experimental validation for reliability, performance, and manufacturability of complex packaging, collaborating with Silicon Design, Supply Chain, and Electrical Design to influence long‑term technology roadmaps.

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FursaFursa
Cisco
Cisco
3 months ago

Mechanical Engineer || System Integration || FEA with Ansys || APDL , 2.5D, 3D Packaging || Exp - 7 to 10 years

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Job Summary

Join Cisco’s Systems & Optics team to shape next‑generation packaging, board, and system technologies. You will drive advanced simulation and experimental validation for reliability, performance, and manufacturability of complex packaging, collaborating with Silicon Design, Supply Chain, and Electrical Design to influence long‑term technology roadmaps.
Location: Bengaluru
Workplace: Onsite
Employment Type: Full time
Job Function: Field Service, Maintenance & Skilled Trades

Key Responsibilities

  • •Develop and apply novel simulation and experimental methods to enable and optimize advanced hardware technologies, including scalable multiphysics models to predict system-level performance, reliability, and manufacturability (e.g., solder joint reliability, warpage, TIM behavior).
  • •Design and execute DOEs/test vehicles and computational analyses to establish design guidelines and optimize material, geometry, and architecture.
  • •Evaluate tradeoffs across performance, reliability, and manufacturability using modeling and analysis.
  • •Collaborate with academia and industry partners; contribute to standards bodies, conferences, IP development, and peer-reviewed publications.

Key Requirements

  • •MS or PhD in Mechanical Engineering, Civil Engineering, Solid Mechanics, or Materials Science
  • •7+ years of experience in numerical analysis (e.g., FEA, CFD, coupled field analysis) and advanced packaging technology development
  • •Strong background in mechanical design, reliability, and simulation of complex packaging structures, with a deep understanding of component- and board-level failure modes (e.g., warpage, CTE mismatch, delamination, fatigue)
  • •Proficiency in advanced simulation tools such as ANSYS Mechanical, Multiphysics, and Flotherm, with a track record of validating models through experimental methods
  • •Demonstrated expertise in reliability testing, lifetime prediction methodologies, and characterization of real-world use conditions
Experience:7+ yearsHardwarePackagingSemiconductorsElectronics
Education:Master's
Skills:FEAANSYSMultiphysicsFlothermCFDDOEMechanical design
Tech Stack:ANSYSMultiphysicsFlothermFEACFDDOEMechanical design

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
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