Principal Photonics Integration Engineer

Micron Technology
Boise, Idaho
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: phdSkills: ["Communication","Program leadership","Project management","Data-driven problem solving"]

Lead end-to-end process integration for silicon photonics and heterogeneous integration technologies, taking innovations from concept through manufacturing readiness. The role drives integration and process development for photonic devices and optical interconnects, including process characterization, DOE execution, yield and defect reduction, and root-cause investigations. You’ll partner with device, design, packaging, manufacturing, and supplier teams, and lead technical programs and AI-enabled initiatives to improve efficiency and product performance.

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Micron Technology
Micron Technology
1 week ago

Principal Photonics Integration Engineer

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Job Summary

Lead end-to-end process integration for silicon photonics and heterogeneous integration technologies, taking innovations from concept through manufacturing readiness. The role drives integration and process development for photonic devices and optical interconnects, including process characterization, DOE execution, yield and defect reduction, and root-cause investigations. You’ll partner with device, design, packaging, manufacturing, and supplier teams, and lead technical programs and AI-enabled initiatives to improve efficiency and product performance.
Location: Boise, Idaho
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept through manufacturing readiness.
  • •Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures.
  • •Drive process characterization, DOE execution, yield improvement, defect reduction, root cause investigations, and process optimization activities.
  • •Partner with design, device, packaging, manufacturing, and supplier teams on design rule development, tapeouts, and technology transfers.
  • •Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives that improve development efficiency and product performance.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Leave

Key Requirements

  • •PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or related field, or equivalent experience with 3+ years of applicable industry experience.
  • •Alternatively, a Master’s degree or comparable experience with 5+ years of relevant industry background; or a Bachelor’s degree/equivalent with 7+ years in the industry.
  • •Experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
  • •Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
  • •Experience with process flow architecture, device integration, design rule development, and tape out execution.
Experience:3+ yearsSemiconductor manufacturingSilicon photonics
Education:PhD / Doctorate in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering (or related field)
Skills:CommunicationProgram leadershipProject managementData-driven problem solving
Tech Stack:Silicon photonicsHeterogeneous integrationOptical interconnectsAdvanced packagingProcess characterizationDOEStatistical analysisProcess flow architectureDesign rule developmentTape outHybrid bondingWafer bondingOptical interposersCo-packaged opticsOptical packagingAI-enabled engineering toolsMachine learningAdvanced analyticsWorkflow automation

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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