SpaceX

2 months ago

Sr. IC Package Design Engineer (Silicon Engineering)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 18 hours agoStatus: Live

Job Summary

Lead design and optimization of advanced IC packaging for next-generation ASICs/RFICs, collaborating with cross-functional teams to enable high-speed, power-efficient packages for SpaceX’s Starlink hardware and ground infrastructure.

Location: Austin, Irvine

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Sr. Manager level

Key Responsibilities

•Own and drive advanced package selection, new product BGA configuration and package structure.
•Responsible for package/SIP layout, optimization, design verification and tapeout.
•Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis and design.
•Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out.
•Simulate and optimize signal/power integrity and RF performance of the package design.

Key Requirements

•Bachelor's degree in electrical engineering, computer engineering, or physics
•5+ years of experience with IC package design
•Experience with Co-packaged Optics (CPO)
•Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
•Experience with Cadence APD+/SIP or similar design tools

Experience:5+ yearsSpaceAerospaceSatelliteStarlink

Education:Bachelor's

Skills:CommunicationProblem-solvingCollaboration

Languages:English

Tech Stack:Cadence APD+/SIPSIWaveHFSSADSBGARFICSI/PI

Company Brief

SpaceX

Designs, manufactures, and launches advanced rockets and spacecraft for commercial and government customers, aiming to reduce space transportation costs and enable human life on Mars through reusable launch vehicles and integrated space systems.

Industry: Aerospace Manufacturing

Company Size: Enterprise (1,001+ employees)

Growth: Established Company

Valuation: Hectocorn (USD 100B+)

Funding: Series E+

Headquarters: Hawthorne, United States

Founded: 2002

Glassdoor: 4.2

Website LinkedIn

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SpaceX

2 months ago

Sr. IC Package Design Engineer (Silicon Engineering)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 18 hours agoStatus: Live

Job Summary

Location: Austin, Irvine

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Sr. Manager level

Key Responsibilities

•Own and drive advanced package selection, new product BGA configuration and package structure.
•Responsible for package/SIP layout, optimization, design verification and tapeout.
•Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis and design.
•Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out.
•Simulate and optimize signal/power integrity and RF performance of the package design.

Key Requirements

•Bachelor's degree in electrical engineering, computer engineering, or physics
•5+ years of experience with IC package design
•Experience with Co-packaged Optics (CPO)
•Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
•Experience with Cadence APD+/SIP or similar design tools

Experience:5+ yearsSpaceAerospaceSatelliteStarlink

Education:Bachelor's

Skills:CommunicationProblem-solvingCollaboration

Languages:English

Tech Stack:Cadence APD+/SIPSIWaveHFSSADSBGARFICSI/PI

Company Brief

SpaceX

Industry: Aerospace Manufacturing

Company Size: Enterprise (1,001+ employees)

Growth: Established Company

Valuation: Hectocorn (USD 100B+)

Funding: Series E+

Headquarters: Hawthorne, United States

Founded: 2002

Glassdoor: 4.2

Website LinkedIn