Intel

4 weeks ago

Packaging Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Join Intel’s Advanced Packaging Mechanical Analysis team in Chandler, AZ to develop multiphysics thermo-mechanical simulations for next-generation semiconductor packaging. You will build and validate finite element models to assess stress and reliability, collaborate with design, technology integration, reliability and manufacturing teams, coordinate lab tests, and leverage AI/ML to enhance modeling and experimental approaches across multiple package architectures.

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
•Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
•Drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
•The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
•The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•PhD Degree in Mechanical Engineering, Chemical Engineering or Materials Science or a related field with emphasis in solid mechanics
•3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
•3+ years of experience with Finite Element Analysis tools
•3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation
•Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma

Experience:3+ yearsSemiconductorPackagingMechanical engineering

Education:PhD / Doctorate

Skills:Finite element analysisThermomechanicsMultiphysicsLab testingMaterials characterizationPythonMATLABTCL

Languages:English

Tech Stack:FEAPythonMATLABTCLDMATMANano-indentationAI/ML

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

4 weeks ago

Packaging Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
•Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
•Drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
•The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
•The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•PhD Degree in Mechanical Engineering, Chemical Engineering or Materials Science or a related field with emphasis in solid mechanics
•3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
•3+ years of experience with Finite Element Analysis tools
•3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation
•Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma

Experience:3+ yearsSemiconductorPackagingMechanical engineering

Education:PhD / Doctorate

Skills:Finite element analysisThermomechanicsMultiphysicsLab testingMaterials characterizationPythonMATLABTCL

Languages:English

Tech Stack:FEAPythonMATLABTCLDMATMANano-indentationAI/ML

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor