Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsEducation: bachelorsSkills: ["Technical leadership through influence","Cross-functional collaboration","Cross-site collaboration","Mentorship","Executive-ready communication"]

Provide technical leadership for NAND advanced thin-film process development, defining technical direction and advancing structural and electrical film process integration into manufacturing. Lead cross-functional teams to develop, integrate, and scale thin film process modules for advanced NAND structures/devices, oversee end-to-end development, and resolve complex technical failures with root-cause analysis. Drive technology transfer from R&D to high-volume manufacturing, improving yield, reliability, and cost through process/material innovation.

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Micron Technology
Micron Technology
3 months ago

Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND

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Job Summary

Provide technical leadership for NAND advanced thin-film process development, defining technical direction and advancing structural and electrical film process integration into manufacturing. Lead cross-functional teams to develop, integrate, and scale thin film process modules for advanced NAND structures/devices, oversee end-to-end development, and resolve complex technical failures with root-cause analysis. Drive technology transfer from R&D to high-volume manufacturing, improving yield, reliability, and cost through process/material innovation.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Define and implement the technical strategy for structural and electrical thin-film process development aligned to business and technology objectives.
  • •Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices.
  • •Oversee end-to-end development of process modules focused on manufacturability, scalability, and integration readiness.
  • •Resolve complex technical challenges with significant business impact, including root cause analysis and mitigation of process/device failures.
  • •Drive technology transfer from R&D to high-volume manufacturing, improving cost reduction, yield, and reliability through process/material utilization.

Key Requirements

  • •PhD with 5+ years, or Master’s with 7+ years, or Bachelor’s with 10+ years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related fields.
  • •Demonstrated thin films R&D/PD experience for NAND, including CVD and diffusion thin films.
  • •Mastery of thin film deposition (ALD/CVD) for high-density NAND, including process design/optimization/integration.
  • •Advanced characterization and electrical evaluation capability (e.g., XRR, ellipsometry, SEM, TEM, SIMS, XPS; leakage/impedance/capacitance/breakdown).
  • •Proficiency with SPC/DOE/data analytics for process optimization and fixing, plus ability to drive novel chemistries/materials/hardware solutions.
Experience:5+ yearsNANDThin filmsR&DProcess developmentSemiconductorsManufacturing
Education:Bachelor's in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
Skills:Technical leadership through influenceCross-functional collaborationCross-site collaborationMentorshipExecutive-ready communication
Tech Stack:NANDThin filmsALDCVDDiffusionXRREllipsometrySEMTEMSIMSXPSSPCDOEData analyticsRoot cause analysisChamber designPlasma source optimizationGas deliveryAI assisted tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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