Front End Central Product Integration (FE cPIE) Principal Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunitySkills: ["Leadership","Ownership","Grit","Problem-solving","Data-driven decision making","Organizational skills","Cross-cultural collaboration","Communication","Teamwork","Continuous improvement"]

Lead Micron’s global Central Product Integration (CPIE) efforts for HBM (High Bandwidth Memory), driving yield and quality improvements and enabling new product introductions through technical expertise, business process management, and project execution. Partner with teams across Japan, Taiwan, Singapore, and the US to mature processes within schedule while maintaining high-quality standards, conducting performance reviews, and building continuous improvement and AI-enabled productivity in daily work.

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Micron Technology
Micron Technology
1 month ago

Front End Central Product Integration (FE cPIE) Principal Engineer

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Last checked: 19 hours agoStatus: Live

Job Summary

Lead Micron’s global Central Product Integration (CPIE) efforts for HBM (High Bandwidth Memory), driving yield and quality improvements and enabling new product introductions through technical expertise, business process management, and project execution. Partner with teams across Japan, Taiwan, Singapore, and the US to mature processes within schedule while maintaining high-quality standards, conducting performance reviews, and building continuous improvement and AI-enabled productivity in daily work.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Sr. Manager level

Key Responsibilities

  • •Provide strategic leadership with FAB to drive best-in-class yield ramping and develop process integration toolsets, systems, methodologies, capabilities, and roadmaps.
  • •Conduct ongoing metrics reviews of critical group deliverables; ensure reviews occur across programs/projects and establish structure for subordinate manager reviews.
  • •Direct leadership on most critical deliverables and escalated performance items to remove barriers and apply correct resources; communicate transparently when objectives are at risk.
  • •Set direction and performance goals for team members, establish expectations and job profiles, and drive accountability through feedback and effective project management.
  • •Maintain the group training roadmap, develop successors, coach/mentor team members, and apply AI-assisted tools and insights to improve efficiency, quality, and effectiveness.
Travel: High travel

Key Requirements

  • •Bachelors/Masters/PhD in EE, Materials Engineering, Materials Science, Physics and Chemical Engineering.
  • •7+ years of experience in process-related roles in the semiconductor industry.
  • •Ability to apply digital fluency and AI literacy to use AI-enabled tools responsibly for research, analysis, content creation, problem-solving, and operational tasks.
  • •Strong logical thinking and knowledge of Semiconductor Fabrication process flows, how processes interact, and impacts to yield, device performance, and reliability.
  • •Strong understanding of DRAM and NAND operation/structure and ability to decipher parametric/probe/qual data from front-end and backend assembly processes.
Experience:Semiconductor industryDRAMNAND
Education:
Skills:LeadershipOwnershipGritProblem-solvingData-driven decision makingOrganizational skillsCross-cultural collaborationCommunicationTeamworkContinuous improvement
Tech Stack:AI toolsAI literacy

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn