Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: bachelorsSkills: ["Problem-solving","Root-cause analysis","Data-driven decision making","Communication","People leadership"]

Drive package and HBM product engineering activities for Micron’s HBM Systems and Product Engineering organization. Improve assembly, cube, and cumulative yield while reducing inline fallout through test optimization, coverage enhancements, and root-cause analysis (EFA/PFA). Lead cross-functional initiatives across Fab, HBM technology, design, systems development, and quality/reliability teams, and champion AI/ML models to advance key KPIs like quality, cost, cycle time, and scale.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Drive package and HBM product engineering activities for Micron’s HBM Systems and Product Engineering organization. Improve assembly, cube, and cumulative yield while reducing inline fallout through test optimization, coverage enhancements, and root-cause analysis (EFA/PFA). Lead cross-functional initiatives across Fab, HBM technology, design, systems development, and quality/reliability teams, and champion AI/ML models to advance key KPIs like quality, cost, cycle time, and scale.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Improve ASM yield and DPM to enhance Time 0/Field DPM and reduce inline fallout in the assembly process.
  • •Increase HBM cube yield via test optimization and coverage improvements through collaboration with technology and packaging organizations.
  • •Own cumulative yield and lead cross-functional initiatives to drive quality and yield improvements.
  • •Debug and resolve qualification (Qual) and RMA packaging issues using EFA/PFA, and drive cross-functional corrective actions.
  • •Partner with cross-functional teams to implement backend process conversions for HVM and yield/cost performance, and use AI/ML models to improve key KPIs.

Key Requirements

  • •Bachelors/Masters in Electrical/Electronic/Mechanical Engineering with more than 3 years of experience in the semiconductor industry.
  • •Product engineering and packaging experience (preferred).
  • •Strong root-cause and problem-solving skills using in-depth circuit analysis.
  • •Good knowledge of statistics and data analysis tools, plus scripting experience.
  • •Collaboration experience across teams, with excellent communication and a people-leadership mindset.
Experience:3+ yearsSemiconductor industry
Education:Bachelor's in Electrical/Electronic/Mechanical Engineering
Skills:Problem-solvingRoot-cause analysisData-driven decision makingCommunicationPeople leadership
Tech Stack:AI/MLScriptingStatistics

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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