Staff Engineer, APTD Backgrind/Edge Trim

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 4+ yearsEducation: bachelorsSkills: ["Root-cause analysis","Analytical problem-solving","Independent work","Project management"]

Develop and scale wafer edge trim, backgrind, and thinning processes for Micron’s advanced packaging technology, improving mechanical, electrical, and reliability performance. Use DOE, data analysis, and physics-based problem-solving to optimize yield, cost, and wafer integrity, and to perform root-cause and failure-mode analysis of damage mechanisms like chipping, micro-cracks, warpage, and residual stress. Support transfer and ramp to manufacturing sites.

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Micron Technology
Micron Technology
3 weeks ago

Staff Engineer, APTD Backgrind/Edge Trim

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Last checked: 15 hours agoStatus: Live

Job Summary

Develop and scale wafer edge trim, backgrind, and thinning processes for Micron’s advanced packaging technology, improving mechanical, electrical, and reliability performance. Use DOE, data analysis, and physics-based problem-solving to optimize yield, cost, and wafer integrity, and to perform root-cause and failure-mode analysis of damage mechanisms like chipping, micro-cracks, warpage, and residual stress. Support transfer and ramp to manufacturing sites.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize wafer edge trim, backgrind, and thinning processes to meet mechanical, electrical, and reliability requirements for advanced memory products.
  • •Improve process capability, yield, cost efficiency, and wafer integrity using data-driven optimization and equipment or consumable innovation.
  • •Conduct root-cause and failure-mode analyses for wafer damage mechanisms including edge chipping, micro-cracks, subsurface damage, warpage, and residual stress.
  • •Perform fundamental research and early-stage pathfinding to enable ultra-thin wafer processing for next-generation advanced packaging architectures.
  • •Support process transfer and ramp to production at manufacturing sites, with limited domestic and/or international travel.
Travel: Low travel

Pay and Benefits

Perks:Medical PlansDental PlansVision PlansPaid LeavePaid Holidays

Key Requirements

  • •BS or MS degree with at least 4 years of semiconductor experience in wafer edge trim, backgrind, wafer thinning, CMP, or mechanical wafer processing.
  • •Research and development capability with hands-on work advancing wafer processing capability through structured experimentation and learning.
  • •Expertise in experimental design (DOE), data analysis, and interpreting results to drive actionable process or technology improvements.
  • •Strong physics-based analytical and creative problem-solving for complex mechanical, material, and defect-related wafer challenges.
  • •Ability to resolve complex process, yield, and reliability issues using root-cause analysis, model-based reasoning, and first-principles understanding.
Experience:4+ yearsSemiconductorAdvanced packaging
Education:Bachelor's
Skills:Root-cause analysisAnalytical problem-solvingIndependent workProject management
Tech Stack:PythonMS OfficeData visualizationGenAI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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