Network Engineer - ML Infrastructure (High-Speed Interconnects)

X AI
Palo Alto
Workplace: OnsiteFull timeUSD 180,000 - 440,000 annuallyFunction: Product ManagementExperience: 8+ yearsEducation: mastersSkills: ["Communication","Problem-solving","Team collaboration"]

Design, validate, and productize high-speed copper and optical interconnects for AI clusters at 100k+ GPU scale. Own vendor onboarding for 1.6T transceivers, explore LPO/LRO opportunities, evaluate co-packaged engines, and investigate new interconnect modalities. Collaborate with ML teams and vendors to optimize topology, performance, and cost for large-scale AI training and inference systems.

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FursaFursa
X AI
X AI
7 months ago

Network Engineer - ML Infrastructure (High-Speed Interconnects)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 8 hours agoStatus: Live

Job Summary

Design, validate, and productize high-speed copper and optical interconnects for AI clusters at 100k+ GPU scale. Own vendor onboarding for 1.6T transceivers, explore LPO/LRO opportunities, evaluate co-packaged engines, and investigate new interconnect modalities. Collaborate with ML teams and vendors to optimize topology, performance, and cost for large-scale AI training and inference systems.
Location: Palo Alto
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management

Key Responsibilities

  • •Design, validate, and productize high-speed copper and optical connectivity solutions for AI clusters (100k+ GPU scale).
  • •Own vendor due diligence and onboarding for new 1.6T products including AEC and pluggable optical transceivers (DR4/8, FR4) including rigorous bring-up & characterization.
  • •Investigate the opportunity for LPO and LRO in our network.
  • •Evaluate early co-packaged and near-packaged engines for switches and GPUs.
  • •Pathfinding for new interconnect modalities including VCSEL, microLED, THz radio-based solutions to improve network economics and reliability.

Pay and Benefits

Salary: USD 180,000 - 440,000 annually
Equity and Bonus:Equity
Perks:EquityHealth InsuranceVisionDental401kDisability InsuranceLife Insurance

Key Requirements

  • •8+ years hands-on experience in designing, deploying and operating high-speed copper and optical interconnects, preferably in a module design role or in a hyperscale datacenter environment.
  • •Master's or PhD degree in Electrical Engineering, Photonics or Physics.
  • •Deep knowledge of PAM4 SerDes performance, equalization, jitter, crosstalk.
  • •Solid operational understanding of FEC, Retimers, TIAs and Drivers.
  • •Deep knowledge of optical link budget analysis and performance metrics including TDECQ, OMA, Tcode, stressed receiver sensitivity and associated diagnostics.
Experience:8+ yearsAIMLHyperscale datacenterInterconnects
Education:Master's
Skills:CommunicationProblem-solvingTeam collaboration
Languages:English
Tech Stack:PAM4SerDesFECRetimersTIAsDSPSiPhEMLCPOVCSELPhotonicAOCDR4/8FR4LPOLROTDECQOMAPumped interconnects

Company Brief

X AI
Develops advanced artificial intelligence models and research aimed at building safe, general AI and understanding the fundamental nature of the universe. Focuses on large-scale AI systems, research publications, and building foundational AI capabilities.
Industry: AI & Machine Learning
Company Size: Medium (51 to 250 employees)
Growth: Early Stage Startup
Headquarters: San Francisco, United States
Founded: 2023
Website