SR ENGINEER, APTD PHOTO Process

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3-7 yearsEducation: mastersSkills: ["Independent thinking","Teamwork","Motivation","Communication","Problem-solving"]

Drive PHOTO process development and yield improvement for HBM, troubleshoot complex semiconductor process issues, and perform root-cause analysis to resolve engineering problems. Support advanced packaging technology research (chip stacking, 2.5D/3D) and provide on-site technical consulting. Collaborate across teams on materials characterization, test structure recommendations, and supplier discussions, while producing internal/external documentation and technical reports.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

SR ENGINEER, APTD PHOTO Process

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Drive PHOTO process development and yield improvement for HBM, troubleshoot complex semiconductor process issues, and perform root-cause analysis to resolve engineering problems. Support advanced packaging technology research (chip stacking, 2.5D/3D) and provide on-site technical consulting. Collaborate across teams on materials characterization, test structure recommendations, and supplier discussions, while producing internal/external documentation and technical reports.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Drive HBM process development and improve yield in the PHOTO process.
  • •Assist advanced package technology research and development (chip stacking, 2.5D/3D).
  • •Support on-site project execution and provide technical consulting decisions.
  • •Troubleshoot complex problems, perform root-cause analysis, and resolve process engineering issues.
  • •Generate internal/external documentation for presentations and technical reports.

Key Requirements

  • •3-7 years PHOTO experience in the semiconductor-related industry.
  • •Master’s degree or above (PhD plus) in Chemistry, Physics, Materials, or engineering science related fields.
  • •Solid understanding of photolithography fundamentals, including PR coating/bake/exposure/develop flow.
  • •Familiarity with reticle tapeout, CD control, and overlay metrology concepts.
  • •Fluent communication in both English and Chinese; innovative and independent thinking with strong teamwork motivation.
Experience:3-7 yearsSemiconductorHBMAdvanced packagingPhotolithographyMaterials characterization
Education:Master's in Chemistry, Physic, Material, engineering science related fields
Skills:Independent thinkingTeamworkMotivationCommunicationProblem-solving
Languages:EnglishChinese
Tech Stack:HBMPHOTO processPhotolithographyPR coatingBakeExposureDevelop flowReticle tapeoutCD controlOverlay metrologyChip stacking2.5D3DAdvanced packagingMaterials characterizationRoot cause analysisTest structure designTest vehicle design

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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