Senior Process Engineering Technical Leader

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 13+ yearsEducation: mastersSkills: ["Technical leadership","Problem-solving","Cross-team collaboration","Mentoring","Decision-making"]

Lead the development and scale-up of chip-to-wafer and hybrid bonding processes for next-generation 3D memory, including HBM and 3DS DRAM. Set technical direction across programs, mature process flows and materials to meet performance, reliability, and cost goals, and drive problem solving across wafer fab through downstream packaging interactions. Partner with integration, equipment, product, manufacturing, and quality teams and enable technology transfer into high-volume manufacturing with repeatable processes.

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Micron Technology
Micron Technology
3 months ago

Senior Process Engineering Technical Leader

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Last checked: 15 hours agoStatus: Live

Job Summary

Lead the development and scale-up of chip-to-wafer and hybrid bonding processes for next-generation 3D memory, including HBM and 3DS DRAM. Set technical direction across programs, mature process flows and materials to meet performance, reliability, and cost goals, and drive problem solving across wafer fab through downstream packaging interactions. Partner with integration, equipment, product, manufacturing, and quality teams and enable technology transfer into high-volume manufacturing with repeatable processes.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Set technical direction for chip-to-wafer and hybrid bonding processes across development programs.
  • •Develop and mature process flows, materials, and integrations to meet performance, reliability, and cost needs.
  • •Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions.
  • •Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs.
  • •Drive technology transfer into manufacturing with repeatability and high-volume readiness.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Time-offPaid HolidaysParental Leave

Key Requirements

  • •Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering (or related field).
  • •13+ years of semiconductor R&D experience, including 10+ years in advanced packaging.
  • •Proven ability to lead multi-team technical efforts and drive decisions without formal authority.
  • •Deep expertise in bonding processes such as solder reflow, TCB, and hybrid bonding.
  • •Strong understanding of process and package integration and cross-module interactions.
Experience:13+ yearsSemiconductor R&DAdvanced packaging3D memoryHBMDRAM
Education:Master's
Skills:Technical leadershipProblem-solvingCross-team collaborationMentoringDecision-making
Tech Stack:Chip-to-waferHybrid bondingSolder reflowTCBHBM3DS DRAM

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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