Olix

3 months ago

Senior Packaging Design Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 14 hours agoStatus: Live

Job Summary

Senior/Staff Packaging Engineer responsible for front-end package design, ASIC-to-substrate integration, and advanced 2.5D/3D packaging, leading end-to-end package development from concept to production readiness in a high-performance AI hardware context.

Location: Bristol

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Own or lead the full package design flow, from concept definition through detailed design, analysis, layout, verification, release, and manufacturing support
•Develop and review package layouts including die placement, substrate routing, power/ground distribution, high-speed interface breakout, and physical integration constraints
•Own and execute PI/SI simulation activities to validate signal integrity, power delivery, and package performance, translating results directly into design improvements and sign-off decisions
•Support package-to-board co-design, including substrate layout and PCB layout/interface definition where required
•Ensure strong alignment between die, package, substrate, and board-level implementation

Pay and Benefits

Equity and Bonus:Equity

Perks:EquityHealth InsuranceTime OffRelocationVisa Sponsorship

Key Requirements

•8+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products.
•Deep expertise in front-end package design, including ASIC-to-substrate integration.
•Strong experience with 2.5D and/or 3D package architectures.
•Strong hands-on capability with package design tools such as Cadence Allegro, Siemens Xpedition, or equivalent; PI/SI simulation tools (e.g., Ansys SIwave, Cadence Sigrity)
•Experience leading package development across layout, simulation, verification, and release; cross-functional collaboration

Experience:8+ yearsSemiconductorASICAI hardware

Education:Bachelor's

Skills:PackagingDesign2.5D3D packagingASIC-to-substrate

Tech Stack:Cadence AllegroSiemens XpeditionAnsys SIwaveCadence Sigrity

Eligibility

Visa:UK visa sponsorshipInternational visa sponsorship

Work Authorization:Sponsorship available.

Company Brief

Olix

Olix designs and manufactures optical processors (Optical Tensor Processing Units) for training and running inference on large AI models, aiming to deliver higher performance and lower energy consumption than conventional silicon-based accelerators.

Industry: Deep Tech

Company Size: Medium (51 to 250 employees)

Growth: Early Stage Startup

Headquarters: London, United Kingdom

Founded: 2024

Glassdoor: 3.0

Website LinkedIn Glassdoor

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Olix

3 months ago

Senior Packaging Design Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 14 hours agoStatus: Live

Job Summary

Location: Bristol

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Own or lead the full package design flow, from concept definition through detailed design, analysis, layout, verification, release, and manufacturing support
•Develop and review package layouts including die placement, substrate routing, power/ground distribution, high-speed interface breakout, and physical integration constraints
•Own and execute PI/SI simulation activities to validate signal integrity, power delivery, and package performance, translating results directly into design improvements and sign-off decisions
•Support package-to-board co-design, including substrate layout and PCB layout/interface definition where required
•Ensure strong alignment between die, package, substrate, and board-level implementation

Pay and Benefits

Equity and Bonus:Equity

Perks:EquityHealth InsuranceTime OffRelocationVisa Sponsorship

Key Requirements

•8+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products.
•Deep expertise in front-end package design, including ASIC-to-substrate integration.
•Strong experience with 2.5D and/or 3D package architectures.
•Strong hands-on capability with package design tools such as Cadence Allegro, Siemens Xpedition, or equivalent; PI/SI simulation tools (e.g., Ansys SIwave, Cadence Sigrity)
•Experience leading package development across layout, simulation, verification, and release; cross-functional collaboration

Experience:8+ yearsSemiconductorASICAI hardware

Education:Bachelor's

Skills:PackagingDesign2.5D3D packagingASIC-to-substrate

Tech Stack:Cadence AllegroSiemens XpeditionAnsys SIwaveCadence Sigrity

Eligibility

Visa:UK visa sponsorshipInternational visa sponsorship

Work Authorization:Sponsorship available.

Company Brief

Olix

Industry: Deep Tech

Company Size: Medium (51 to 250 employees)

Growth: Early Stage Startup

Headquarters: London, United Kingdom

Founded: 2024

Glassdoor: 3.0

Website LinkedIn Glassdoor