Firmware Architect – High-Speed Interconnect (PCIe / OCI)

AMD
Austin, Santa Clara, Markham
Workplace: HybridFull timeFunction: Solutions Engineering & Sales EngineeringEducation: high_schoolSkills: ["Communication","Leadership","Collaboration"]

Lead firmware architecture for next-generation high-speed interconnects (PCIe Gen 7/8 and OCI) across AMD server platforms. Drive cross-functional collaboration with hardware, silicon, and platform software teams, guide platform bring-up and debugging, and influence interconnect standards to deliver scalable, high-performance solutions for data centers, AI, and HPC environments.

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FursaFursa
AMD
AMD
3 months ago

Firmware Architect – High-Speed Interconnect (PCIe / OCI)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 10 hours agoStatus: Live

Job Summary

Lead firmware architecture for next-generation high-speed interconnects (PCIe Gen 7/8 and OCI) across AMD server platforms. Drive cross-functional collaboration with hardware, silicon, and platform software teams, guide platform bring-up and debugging, and influence interconnect standards to deliver scalable, high-performance solutions for data centers, AI, and HPC environments.
Location: Austin, Santa Clara, Markham
Workplace: Hybrid
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering

Key Responsibilities

  • •Define and drive firmware architecture for next-generation I/O interconnects, including PCIe Gen 7/8 and OCI, ensuring scalability, performance, and robustness.
  • •Lead the adoption and integration of advanced interconnect technologies, collaborating with hardware architecture and silicon teams to influence design decisions and standards alignment.
  • •Partner with system architecture, silicon design, validation, and platform software teams to deliver cohesive end-to-end solutions across pre- and post-silicon phases.
  • •Guide platform bring-up, debug, and optimization for complex I/O subsystems, ensuring high reliability and performance in production environments.
  • •Stay at the forefront of industry trends and standards (PCIe, CXL, OCI), contributing to AMD’s leadership in next-generation interconnect ecosystems.

Key Requirements

  • •Extensive experience in firmware and system architecture for high-speed interconnects
  • •Strong expertise in PCIe Gen 6+ and emerging PCIe Gen 7/8 technologies
  • •Experience with platform bring-up, pre/post-silicon validation, and debugging complex I/O and firmware issues
  • •Ability to influence architecture and drive cross-organizational alignment
  • •Bachelor’s or Master’s degree in Computer Science, Computer Engineering, Electrical Engineering, or equivalent
Experience:High-speed interconnectsFirmwareServer platforms
Education:High School
Skills:CommunicationLeadershipCollaboration
Languages:English
Tech Stack:PCIePCIe Gen7/8OCIFirmwareInterconnectPlatform bring-up

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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