Process Integration, Yield and Defect Reduction Engineering Lead

Intel
Albuquerque
Workplace: OnsiteFull timeUSD 140,830 - 198,820 annuallyFunction: Administration & Executive AssistanceExperience: 5+ yearsEducation: bachelorsSkills: ["Technical leadership","Problem-solving","Cross-functional collaboration","Stakeholder management","Project management"]

Lead advanced packaging process integration efforts to transfer, ramp, and sustain manufacturing technologies and meet foundry customer commitments. Partner with Advanced Packaging HVM engineering and factory operations to improve yield, quality, reliability, and manufacturing efficiency through data-driven defect reduction. Grow into a team lead role supporting technical contributors, driving continuous improvement using statistical process control, DOE, and defectivity/parametric analysis.

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Intel
Intel
4 days ago

Process Integration, Yield and Defect Reduction Engineering Lead

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Source: Company careers pageValidated by: Fursa AI
Last checked: 2 hours agoStatus: Live

Job Summary

Lead advanced packaging process integration efforts to transfer, ramp, and sustain manufacturing technologies and meet foundry customer commitments. Partner with Advanced Packaging HVM engineering and factory operations to improve yield, quality, reliability, and manufacturing efficiency through data-driven defect reduction. Grow into a team lead role supporting technical contributors, driving continuous improvement using statistical process control, DOE, and defectivity/parametric analysis.
Location: Albuquerque
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Manager level

Key Responsibilities

  • •Collaborate with Advanced Packaging HVM engineering and factory operations to support transfer, ramp, and sustainment of advanced packaging technologies.
  • •Ensure successful execution against foundry customer commitments while improving yield, quality, reliability, and manufacturing efficiency.
  • •Lead and grow into a Process Integration team lead role managing teams of technical contributors supporting advanced packaging manufacturing operations.
  • •Analyze defectivity and parametric data to identify yield limiters and drive process improvements.
  • •Apply data-driven methods (including DOE and statistical process control) to advance process capability analysis and operational excellence.

Pay and Benefits

Salary: USD 140,830 - 198,820 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor's or Master's degree in a technical field such as Chemical, Electrical, Mechanical, Materials Science, Microelectronics Engineering, Chemistry, or Physics.
  • •5+ years of experience in semiconductor manufacturing or advanced packaging.
  • •5+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes.
  • •3+ years of experience applying Design of Experiments (DOE) methodologies.
  • •5+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms.
Experience:5+ yearsSemiconductor manufacturingAdvanced packaging
Education:Bachelor's
Skills:Technical leadershipProblem-solvingCross-functional collaborationStakeholder managementProject management
Tech Stack:JMPSQLPCSDesign of Experiments (DOE)Statistical process controlFMEAFailure Modes and Effects Analysis (FMEA)

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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